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DSM2190F4V
DSM (Digital Signal Processor System Memory) For Analog Devices ADSP-2191 DSPs (3.3V Supply)
FEATURES SUMMARY s Glueless Connection to DSP - Easily add memory, logic, and I/O to the External Port of ADSP-2191 DSP s Dual Flash Memories - Two independent Flash memory arrays for storing DSP code and data. DSP may access the two arrays concurrently (read from one while erasing or writing the other) - 256K x 8 Main Flash memory divided into 8 sectors (32KByte each) - Ample storage for booting DSP code/data upon reset and subsequent code swaps - Large capacity for data recording - 32K x 8 Secondary Flash memory divided into 4 sectors (8 KByte each). Multiple uses: - Small sector size ideal for small data sets, and calibration or configuration constants - Store custom start-up code in one or more sectors and configure DSP to run from external memory upon reset (no boot) - Concatenate Secondary Flash with Main Flash for total of 288 KBytes - Each Flash sector can be write protected. - Built-in programmable address decoding logic allows mapping individual Flash sectors to any address boundary s Up to 16 Multifunction I/O Pins - Increase total DSP system I/O capability - I/O controlled by DSP software or PLD logic s General purpose PLD - Over 3,000 Gates of PLD with 16 macro cells - Use for peripheral glue logic to keypads, control panel, displays, LCDs, and other devices - Eliminate PLDs and external logic devices - Create state machines, chip selects, simple shifters and counters, clock dividers, delays - Simple PSDsoft ExpressTM software...Free s Operating Range - VCC: 3.3V10%; Temperature: -40oC to +85oC
s
Figure 1. Packages
PQFP52 (T)
PLCC52 (K)
In-System Programming (ISP) with JTAG
- Program entire chip in 10-25 seconds with no involvement of the DSP - Links with ADSP-2191 JTAG debug port - Eliminate sockets for pre-programmed memory and logic devices - ISP allows efficient manufacturing and product testing supporting Just-In-Time inventory - Use low-cost FlashLINKTM cable with PC s Content Security - Programmable Security Bit blocks access of device programmers and readers s Zero-Power Technology - As low as 25A standby current s Packaging - 52-pin PQFP or 52-pin PLCC s Flash Memory Speed, Endurance, Retention - 150 ns, 100K cycles, 15 year retention
September 2002
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TABLE OF CONTENTS Summary Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 DSP Address/Data/Control Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Main Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Secondary Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Programmable Logic (PLDs) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Runtime Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Memory Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 JTAG ISP Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Security and NVM Sector Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Typical connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical Memory Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Specifying the Memory Map with PSDsoft ExpressTM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Runtime control register definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Detailed Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Flash Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Instruction Sequences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Reading Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Programming Flash Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Erasing Flash Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Flash Memory Sector Protect. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 DSM Security Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Reset Flash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Page Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 PLDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Decode PLD (DPLD). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
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Complex PLD (CPLD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 DSP Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 I/O Ports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Port Operating Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Port B - Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Port C - Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 Port D - Functionality and Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 PLD Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 PSD Chip Select Input (CSI, PD2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Power On Reset, Warm Reset, Power-down . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Programming In-Circuit using JTAG ISP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 AC/DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 Table: Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43 Table: Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44 Table: DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46 Table: CPLD Combinatorial Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Table: CPLD Macrocell Synchronous Clock Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Table: CPLD Macrocell Asynchronous Clock Mode Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48 Table: Input Macrocell Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 Table: Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Table: Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Table: Flash Memory Program, Write and Erase Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Table: Reset (Reset) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Table: ISC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Package Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55 Table: PLCC52 - 52 lead Plastic Leaded Chip Carrier, rectangular . . . . . . . . . . . . . . . . . . . . . . . . 55 Table: Assignments - PLCC52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Table: PQFP52 - 52 lead Plastic Quad Flatpack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57 Table: Pin Assignments - PQFP52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58 Table: Ordering Information Scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
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SUMMARY DESCRIPTION The DSM2190F4 is a system memory device for use with the Analog Devices ADSP-2191 DSP. DSM means Digital signal processor System Memory. A DSM device brings In-System Programmable (ISP) Flash memory, parameter storage, programmable logic, and additional I/O to DSP systems. The result is a simple and flexible two-chip solution for DSP designs. DSM devices provide the flexibility of Flash memory and smart JTAG programming techniques for both manufacturing and the field. On-chip integrated memory decode logic makes it easy to map dual banks of Flash memory to the ADSP-2191 in a variety of ways for bootloading, code execution, data recording, code swapping, and parameter storage. JTAG ISP reduces development time, simplifies manufacturing flow, and lowers the cost of field upgrades. The JTAG ISP interface eliminates the need for sockets and pre-programmed memory and logic devices. For manufacturing, end products may be assembled with a blank DSM device soldered to the circuit board and programmed at the end of the manufacturing line in 10 to 25 seconds with no involvement of the DSP. This allows efficient means to test product and manage inventory by rapidly programming test code, then appli-
cation code as determined by inventory requirements (Just-In Time inventory). Additionally, JTAG ISP reduces development time by turning fast iterations of DSP code in the lab. Code updates in the field require no disassembly of product. The FlashLINKTM JTAG programming cable costs $59 USD and plugs into any PC or notebook parallel port. In addition to ISP Flash memory, DSM devices add programmable logic (PLD) and up to 16 configurable I/O pins to the DSP system. The state of each I/O pin can be driven by DSP software or PLD logic. PLD and I/O configuration are programmable by JTAG ISP, just like the Flash memory. The PLD consists of more than 3000 gates and has 16 macro cell registers. Common uses for the PLD include chip selects for external devices, state-machines, simple shifters and counters, keypad and control panel interfaces, clock dividers, handshake delay, multiplexers, etc. This eliminates the need for small external PLDs and logic devices. Configuration of PLD, I/O, and Flash memory mapping are easily entered in a pointand-click environment using the software development tool, PSDsoft ExpressTM. This software is available at no charge from www.st.com/psm.
Figure 2. System Block Diagram, Two-Chip Solution
DSM2190F4 DSP SYSTEM MEMORY
16 FLAGS
ADDR & DECODE LOGIC
TIMER/ CAPTURE SERIAL DEVICE SERIAL DEVICE SERIAL DEVICE UART DEVICE HOST MCU
22 ADDRESS
WR, RD, BMS, MSx, IOMS
PRIMARY FLASH MEMORY 256K X 8 8 I/O PORTS SECONDARY FLASH MEMORY 32K X 8 I/O, PLD, CHIP SELECTS
ADSP-2191
16 MACROCELL PLD I/O CONTROL POWER MANAGEMENT CONTENT SECURITY
I/O BUS
ANALOG DEVICES DSP
8 DATA
8 I/O PORTS
JTAG ISP TO ALL AREAS
I/O, PLD, CHIP SEL
JTAG ISP
JTAG DEBUG
AI04959B
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The two-chip combination of a DSP and a DSM device is ideal for systems which have limitations on size, EMI levels, and power consumption. DSM memory and logic are "zero-power", meaning they automatically go to standby between memory accesses or logic input changes, producing low active and standby current consumption, which is ideal for battery powered products. A programmable security bit in the DSM protects its contents from unauthorized viewing and copying. When set, the security bit will block access of programming devices (JTAG or others) to the DSM Flash memories and PLD configuration. The only way to defeat the security bit is to erase the entire DSM device, after which the device is blank and may be used again. The DSP will always have access to Flash memory contents through the 8-bit data port even while the security bit is set.
Table 1. DSM2190F4V DSP Memory System Devices
Part Number Main Flash Memory 256KBytes = 8 sectors x 32KByte 256KBytes = 8 sectors x 32KByte Secondary Flash Memory 32KBytes = 4 sectors x 8KByte 32KBytes = 4 sectors x 8KByte PLD 16 macro -cells 16 macro -cells I/O Ports Up to 16 Up to 16 VCC and I/O Mem Operating Package Speed Temp 52-pin PQFP 52-pin PLCC -40oC to +85oC -40oC to +85oC
DSM2190F4VV15T6 DSM2190F4VV15K6
3.3V 10%
150 ns
3.3V 10%
150 ns
Table 2. Compatible Analog Devices DSP
DSP Part Number ADSP-2191M Operating Voltage, VCC 2.5V I/O Capability 2.5 - 3.6V
Figure 3. PLCC Connections
CNTL2 RESET CNTL1 CNTL0 PB0 PB1 PB2 PB3 PB4 PB5 GND PB6 PB7
Figure 4. PQFP Connections
PD2 PD1 PD0 PC7 PC6 PC5 PC4 VCC GND PC3 PC2 PC1 PC0
8 9 10 11 12 13 14 15 16 17 18 19 20
21 22 23 24 25 26
46 45 44 43 42 41 40 39 38 37 36 35 34
27 28 29 31 32 30 33
AD15 AD14 AD13 AD12 AD11 AD10 AD9 AD8 VCC AD7 AD6 AD5 AD4
PA7 14 PA6 15 PA5 16 PA4 17 PA3 18 GND 19 PA2 20 PA1 21 PA0 22 AD0 23 AD1 24 AD2 25 AD3 26 PD2 1 PD1 2 PD0 3 PC7 4 PC6 5 PC5 6 PC4 7 VCC 8 GND 9 PC3 10 PC2 11 PC1 12 PC0 13 39 AD15 38 AD14 37 AD13 36 AD12 35 AD11 34 AD10 33 AD9 32 AD8 31 VCC 30 AD7 29 AD6 28 AD5 27 AD4
PA7
PA6
PA5
PA4
PA3
PA2
PA1
PA0
AD1
AD2
GND
AD0
AD3
40 CNTLO
41 RESET
43 CNTL1
42 CNTL2
46 GND
52 PB0
51 PB1
50 PB2
49 PB3
48 PB4
47 PB5
45 PB6
44 PB7
4
7
5
3
2
52
51
50
49
48
47
6
1
AI02858
AI02857
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ARCHITECTURAL OVERVIEW Major functional blocks are shown in Figure 5. DSP Address/Data/Control Interface These DSP signals attach directly to the DSM for a glueless connection. An 8-bit data connection is formed and all 22 DSP address lines can be decoded as well as DSP memory strobes; BMS, IOMS, and MSx. There are many different ways the DSM2190F4 can be configured and used depending on system requirements. One convenient way is to combine the function of the MSx signals into the BMS signal. Doing this allows the DSP core to access DSM memory at runtime even after the boot process is complete using only the BMS signal. Combining MSx and BMS consumes less I/O pin(s) on the DMS device. See Analog Devices ADSP-2191 DSP Hardware Reference Manual, Chapter 7, Code Example: BMS Runtime Access. Alternatively, any of the MSx signals may also be used to decode any of the sectors of DSM Main Flash or Secondary flash memories. Main Flash Memory The 2M bit (256K x 8) Flash memory is divided into eight equally-sized 32K byte sectors that are individually selectable through the Decode PLD. Each Flash memory sector can be located at any address as defined by the user with PSDsoft Express. DSP code and data is easily placed in flash memory using the PSDsoft Express software development tool. Secondary Flash Memory The 256K bit (32K x 8) Flash memory is divided into eight equally-sized 8K byte sectors that are individually selectable through the Decode PLD. Each Flash memory sector can be located at any address as defined by the user with PSDsoft Express. DSP code and data can also be placed Secondary Flash memory using the PSDsoft Express development tool. Secondary flash memory is good for storing data because of its small sectors. Additionally, software EEPROM emulation techniques can be used for small data sets that change frequently on a byteby-byte basis. Secondary flash may also be used to store custom start-up code for applications that do not "boot" using DMA, but instead start executing code from external memory upon reset. Storing code here can keep the entire Main Flash free of initialization code for clean software partitioning. If only one or more 8K byte sectors are needed for start-up code, the remaining sectors of Secondary Flash may be used for data storage.
Secondary Flash may also be used as an extension to Main Flash memory producing a total of 288K bytes Miscellaneous: Main and Secondary Flash memories are totally independent, allowing concurrent operation if needed. The DSP can read from one memory while erasing or programming the other. The DSP can erase Flash memories by individual sectors or the entire Flash memory array may be erased at one time. Each sector in either Flash memory may be individually write protected, blocking any writes from the DSP (good for boot and start-up code protection). The Flash memories automatically go to standby between DSP read or write accesses to conserve power. Maximum access times include sector decoding time. Maximum erase cycles is 100K and data retention is 15 years minimum. Flash memory, as well as the entire DSM device may be programmed with the JTAG ISP interface with no DSP involvement. Programmable Logic (PLDs) The DSM family contains two PLDS that may optionally run in Turbo or Non-Turbo mode. PLDs operate faster (less propagation delay) while in Turbo mode but consume more power than NonTurbo mode. Non-Turbo mode allows the PLDs to automatically go to standby when no inputs are change to conserve power. The Turbo mode setting is controlled at runtime by DSP software. Decode PLD (DPLD). This is programmable logic used to select one of the eight individual Main Flash memory segments, one of four individual Secondary Flash memory segments, or the group of control registers within the DSM device. The DPLD can also optionally drive external chip select signals on Port D pins. DPLD input signals include: DSP address and control signals, Page Register outputs, DSM Port Pins, CPLD logic feedback. Complex PLD (CPLD). This programmable logic is used to create both combinatorial and sequential general purpose logic. The CPLD contains 16 Output Macrocells (OMCs) and 16 Input Macrocells (IMCs). PSD Macrocell registers are unique in that that have direct connection to the DSP data bus allowing them to be loaded and read directly by the DSP at runtime. This direct access is good for making small peripheral devices (shifters, counters, state machines, etc.) that are accessed directly by the DSP with little overhead. DPLD inputs include DSP address and control signals, Page Register outputs, DSM Port Pins, and CPLD feedback.
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Figure 5. Block Diagram
INTERNAL ADDR, DATA, CONTROL BUS LINKED TO DSP SECURITY LOCK PAGE REG
fs0
MAIN FLASH MEMORY
fs7
DSM2190F4 DSP SYSTEM MEMORY
DSP DATA PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7
DSP ADDR AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 PD0 PD1 PD2
DECODE PLD (DPLD)
FS0-7
8 SEGMENTS, 32 KB 256 KBytes TOTAL 2nd FLASH MEMORY
csboot3
CSBOOT0-3
csboot0
4 SEGMENTS, 8 KB 32 KBytes TOTAL RUNTIME CONTROL CSIOP REGISTER FILE POWER MANAGEMENT EXTERNAL CHIP SELECTS COMPLEX PLD (CPLD) AND ARRAY
CSIOP PLD INPUT BUS
I/O PORT EXTERNAL CHIP SELECTS, ESC0-2 PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
AAA BBB BBB CCC 16 Output BB CC
AAAA BBBB BBBB CCCC Macrocells B B B C B
A B B C
ALLOCATOR
DSP CONTROL CNTL0 CNTL1 CNTL2 PC2 RST\ PIN FEEDBACK NODE FEEDBACK
B C
B
I/O PORT PC0 PC1 PC3 PC4 PC5 PC6 PC7
CC
CC
16 Input Macrocell
JTAG-ISP TO ALL AREAS OF CHIP
AI04960B
OMCs: The general structure of the CPLD is similar in nature to a 22V10 PLD device with the familiar sum-of-products (AND-OR) construct. True and compliment versions of 64 input signals are available to a large AND array. AND array outputs feed into a multiple product-term OR gate within each OMC (up to 10 product-terms for each OMC). Logic output of the OR gate can be passed on as combinatorial logic or combined with a flipflop within in each OMC to realize sequential logic. OMCs can be used as a buried nodes with feedback to the AND array or OMC output can be routed to pins on Port B or PortC. IMCs: Inputs from pins on Port B or Port C are routed to IMCs for conditioning (clocking or latching) as they enter the chip, which is good for sampling and debouncing inputs. Alternatively, IMCs can pass Port input signals directly to PLD inputs without clocking or latching. The DSP may read the IMCs at any time.
Runtime Control Registers A block of 256 bytes is decoded inside the DSM device as DSM control and status registers. 27 registers are used in the block of 256 locations to control the output state of I/O pins, to read I/O pins, to control power management, to read/write macrocells, and other functions at runtime. See Table 4 for description. The base address of these 256 locations is referred to in this data sheet as csiop (Chip Select I/O Port). Individual registers within this block are accessed with an offset from the base address. The DSP accesses csiop registers using I/O memory with the IOMS strobe. csiop registers are accessed as bytes. Memory Page Register This 8-bit register can be loaded and read by the DSP at runtime as one of the csiop registers. Its outputs feed directly into the PLDs. The page register can be used for special memory mapping requirements and also for general logic.
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I/O Ports The DSM has 19 individually configurable I/O pins distributed over the three ports (Ports B, C, and D). Each I/O pin can be individually configured for different functions such as standard MCU I/O ports or PLD I/O on a pin by pin basis. (MCU I/O means that for each pin, its output state can be controlled or its input value can be read by the DSP at runtime using the csiop registers like an MCU would do.) Port C hosts the JTAG ISP signals. Since JTAGISP does not occur frequently during the life of a product, those Port C pins are under-utilized. In applications that need every I/O pin, JTAG signals can be multiplexed with general I/O signals to use them for I/O when not performing ISP. See section titled "Programming In-Circuit using JTAG ISP" on page 40 for muxing JTAG pins on Port C, and Application Note AN1153. The static configuration of all Port pins is defined with the PSDsoft ExpressTM software development tool. The dynamic action of the Ports pins is controlled by DSP runtime software. JTAG ISP Port In-System Programming (ISP) can be performed through the JTAG signals on Port C. This serial interface allows programming of the entire DSM device or subsections (that is, only Flash memory but not the PLDs) without the participation of the DSP. A blank DSM device soldered to a circuit board can be completely programmed in 10 to 25 seconds. The basic JTAG signals; TMS, TCK, TDI, and TDO form the IEEE-1149.1 interface. The DSM device does not implement the IEEE-1149.1 Boundary Scan functions. The DSM uses the JTAG interface for ISP only. However, the DSM device can reside in a standard JTAG chain with other JTAG devices (including the ADSP-2191) and it will remain in BYPASS mode while other devices perform Boundary Scan. ISP programming time can be reduced as much as 30% by using two more signals on Port C, TSTAT and TERR in addition to TMS, TCK, TDI and TDO. The FlashLINK TM JTAG programming cable is available from STMicroelectronics for $59USD and PSDsoft Express software is available at no charge from www.st.com/psm. That is all that is needed to program a DSM device using the parallel port on any PC or note-book. See section titled "Programming In-Circuit using JTAG ISP" on page 40. Power Management The DSM has bits in csiop control registers that are configured at run-time by the DSP to reduce power consumption of the CPLD. The Turbo bit in the PMMR0 register can be set to logic 1 and the CPLD will go to Non-Turbo mode, meaning it will latch its outputs and go to sleep until the next transition on its inputs. There is a slight penalty in PLD performance (longer propagation delay), but significant power savings are realized. Additionally, bits in two csiop registers can be set by the DSP to selectively block signals from entering the CPLD which reduces power consumption. See section titled "Power Management" on page 37. Security and NVM Sector Protection A programmable security bit in the DSM protects its contents from unauthorized viewing and copying. When set, the security bit will block access of programming devices (JTAG or others) to the DSM Flash memory and PLD configuration. The only way to defeat the security bit is to erase the entire DSM device, after which the device is blank and may be used again. Additionally, the contents of each individual Flash memory sector can be write protected (sector protection) by configuration with PSDsoft ExpressTM. This is typically used to protect DSP boot code from being corrupted by inadvertent writes to Flash memory from the DSP. Pin Assignments Pin assignment are shown for the 52-pin PLCC package in Figure 3, and the 52-pin PQFP package in Figure 4.
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Table 3. Pin Description
Pin Name ADIO0-15 CNTL0 CNTL1 CNTL2 Reset PA0-7 Type In In In In In I/O Sixteen address inputs from the DSP. Active low write strobe input (WR) from the DSP Active low read strobe input (RD) from the DSP. Active low Byte Memory Select (BMS) signal from the DSP. Active low reset input from system. Resets DSM I/O Ports, Page Register contents, and other DSM configuration registers. Must be logic Low at Power-up. Eight data bus signals connected to DSP pins D8 - D15. Eight configurable Port B signals with the following functions: 1. MCU I/O - DSP may write or read pins directly at runtime with csiop registers. 2. CPLD Output Macrocell (McellAB0-7 or McellBC0-7) outputs. 3. Inputs to the PLDs (Input Macrocells). Note: Each of the four Port B signals PB0-PB3 may be configured at run-time as either standard CMOS or for high slew rate. Each of the four Port B signals PB3-PB7 may be configured at run-time as either standard CMOS or Open Drain Outputs. Eight configurable Port C signals with the following functions: 1. MCU I/O - DSP may write or read pins directly at runtime with csiop registers. 2. CPLD Output Macrocell (McellBC0-7) output. 3. Input to the PLDs (Input Macrocells). 4. Pins PC0, PC1, PC5, and PC6 can optionally form the JTAG IEEE-1149.1 ISP serial interface as signals TMS, TCK, TDI, and TDO respectively. 5. Pins PC3 and PC4 can optionally form the enhanced JTAG signals TSTAT and TERR respectively. Reduces ISP programming time by up to 30% when used in addition to the standard four JTAG signals: TDI, TDO, TMS, TCK. 6. Pin PC3 can optionally be configured as the Ready/Busy output to indicate Flash memory programming status during parallel programming. May be polled by DSP or used as DSP interrupt to indicate when Flash memory byte programming or erase operations are complete. Note 1: Port C pin PC2 input (or any PLD input pin) can be connected to the DSP IOMS output. See Figure 6. Note 2: When used as general I/O, each of the eight Port C signals may be configured at run-time as either standard CMOS or Open Drain Outputs. Note 3: The JTAG ISP pins may be multiplexed with other I/O functions. Three configurable Port D signals with the following functions: 1. MCU I/O - DSP may write or read pins directly at runtime with csiop registers. 2. Input to the PLDs (no associated Input Macrocells, routes directly into PLDs). 3. CPLD output (External Chip Select). Does not consume Output Macrocells. 4. Pin PD1 can optionally be configured as CLKIN, a common clock input to PLD. 5. Pin PD2 can optionally be configured as CSI, an active low Chip Select Input to select Flash memory. Flash memory is disabled to conserve more power when CSI is logic high. Can connect CSI to ADSP-218X PWDACK output signal. Note 1: Port D pin PD0 (or any PLD input pin) can be connected to the DSP A16 output. See Figure 6 Note 2: Port D pin PD1 (or any PLD input pin) can be connected to the DSP A17 output. See Figure 6. Note 3: Port D pin PD2 (or any PLD input pin) can be connected to the DSP A18 output. See Figure 6 Supply Voltage Ground pins Description
PB0-7
I/O
PC0-7
I/O
PD0-2
I/O
VCC GND
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TYPICAL CONNECTIONS Figure 6 shows a typical connection scheme. Many connection possibilities exist since many DSM pins are multipurpose. This scheme illustrates the use of a combined function BSM signal (functions as BMS and MSx), and many I/O pins. It also illustrates how to chain the DSM and DSP devices together on the JTAG bus. The JTAG connector definition depends on development and production environment requirements. A specially defined connector can be devised to combine the signals of the FlashLINK and the Analog Devices emulator. Alternatively, two separate JTAG connectors can be used, one matching the pinout of FlashLINK and the other matching the emulator pinout. Keep in mind that signals BMS, IOMS, MSx, ADDR16, ADDR17, ADDR18 can be connected to any DSM pin that is a PLD input. I/O pins on Port B and Port C are more capable (more PLD functions) than Port D pins. It is recommended to use Port D pins primarily for decode inputs first, leaving pins on Port B and Port C available for general
logic. Figure 6 illustrates a common way to make connections. Following are connection options to consider: Port C JTAG: Figure 6 shows four JTAG signals (TMS, TCK, TDI, TDO) connected to the DSM. Alternatively, using six-pin JTAG (two more signals, TSTAT and TERR) can reduce ISP time by as much as 30% compared to four-pin JTAG. Other JTAG options include multiplexing JTAG pins with general I/O (see "Programming In-Circuit using JTAG ISP" on page 40 and Application Note AN1153), or not using JTAG at all. If no JTAG is used, the DSM device has to be programmed on a conventional programmer before it is installed on the circuit board. Using no JTAG makes more DSM I/O available. Pins PC2 and PD2. If not all 288K address locations need to be decoded in the DSM, then ADDR18 on pin PD2 is not needed. In this case, the IOMS signal can be connected to pin PD2, freeing pin PC2 for general I/O usage.
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BUS_REQUEST BUS_GRANT GRANT_HUNG
_BR _BG _BGH
ADSP-2191
DSM2190F4
PLL BYPASS CLOCK OUT
BYPASS CLKOUT CLKIN XTAL
_WR _RD _BMS _IOMS _MSx ACK CNTL0 CNTL1 CNTL2 PC2 WRITE READ BOOT MEM SELECT I/O MEM SELECT
D0 D1 D2 D3 D4 D5 D6 D7 PA0 PA1 PA2 PA3 PA4 PA5 PA6 PA7
DATA0 DATA1 DATA2 DATA3 DATA4 DATA5 DATA6 DATA7
Figure 6. Typical Connections
CLOCK or XTAL
PB0 PB1 PB2 PB3 PB4 PB5 PB6 PB7
I/O I/O I/O
I/O I/O I/O I/O I/O I/O I/O I/O
VCC
I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O optional TSTAT optional _TERR TMS TCK TDI TDO
33 ohm
PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 PF8 PF9 PF10 PF11 PF12 PF13 PF14 PF15 SPORT0 SERIAL CHN SPORT1 SERIAL CHN A16 A17 A18 PD0 PD1 PD2 _RESET
_RESET ADDR16 ADDR17 ADDR18
A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12 A13 A14 A15 PC7 PC3 PC4 PC0 PC1 PC5 PC6
ADIO0 ADIO1 ADIO2 ADIO3 ADIO4 ADIO5 ADIO6 ADIO7 ADIO8 ADIO9 ADIO10 ADIO11 ADIO12 ADIO13 ADIO14 ADIO15
SERIAL DEVICE SPORT1 SERIAL CHN _RESET
RESET
SERIAL DEVICE RxD, TxD
UART DEVICE TMR2-0
TDI TDO TCK TMS _TRST _EMU BMODE0 BMODE1 OPMODE JTAG TDI JTAG TDO JTAG TCK JTAG TMS
HOST PORT Hx
JTAG _TRST EMULATOR STATUS
33 ohm
JTAG_TRST EMULATOR STATUS
DSM2190F4
AI04961B
DSP JTAG CONNECTOR
JTAG_TDI JTAG_TDO JTAG_TCK JTAG_TMS
TIMER/ CAPTURE
DSM JTAG CONNECTOR
SERIAL DEVICE
ADDR0 ADDR1 ADDR2 ADDR3 ADDR4 ADDR5 ADDR6 ADDR7 ADDR8 ADDR9 ADDR10 ADDR11 ADDR12 ADDR13 ADDR14 ADDR15
10k ohm
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TYPICAL MEMORY MAP There many different ways to place (or map) the addresses of DSM memory and I/O depending on system requirements. The DPLD allows complete mapping flexibility. Figure 7 shows one possible system memory map. In this case, the DSP will bootload (via DMA) the contents of Main Flash memory upon reset. The Secondary Flash memory can be used for parameter storage or additional code storage. BMS and MSx are configured in the DSP to be combined into the BMS signal, allowing the DSP to access both Flash memories at runtime (after DMA boot). The DSP may execute code
directly from the DSM and well as erase and write new code or data to DSM Flash. The nomenclature fs0..fs7 are designators for the individual sectors of Main Flash memory, 32K bytes each. csboot0..csboot3 are designators for the individual Secondary Flash memory segments, 8K bytes each. csiop designates the DSM control register block. The designer may easily specify memory mapping in a point-and-click software environment using PSDsoft ExpressTM.
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Figure 7. Typical System Memory Map
DSP Boot Memory Space (BMS)
56000-57FFF 54000-55FFF 52000-53FFF 50000-51FFF 4FFFF
fs7 32K bytes Main Flash csboot, 8KB csboot, 8KB csboot, 8KB csboot, 8KB 2nd 2nd 2nd 2nd Flash Flash Flash Flash
DSP I/O Memory Space (IOMS)
csiop
256 CONTROL REGS
02000-020FF
48000 47FFF
fs6 32K bytes Main Flash
40000 3FFFF
fs5 32K bytes Main Flash
38000 37FFF
fs4 32K bytes Main Flash
30000 2FFFF
fs3 32K bytes Main Flash
28000 27FFF
fs2 32K bytes Main Flash
20000 1FFFF
fs1 32K bytes Main Flash
18000 17FFF
fs0 32K bytes Main Flash
10000
AI04962
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SPECIFYING THE MEMORY MAP WITH PSDSOFT EXPRESSTM The memory map shown in Figure 7 can be easily statements of the ABEL language. Figure 8 shows implemented using PSDsoft ExpressTM in a pointthe resulting equations generated by PSDsoft Exand-click environment. PSDsoft ExpressTM will pressTM. generate Hardware Definition Language (HDL) Figure 8. HDL Statements Generated from PSDsoft Express to Implement Memory Map csiop = ((address >= ^h2000) & (address <= ^h20FF) & (!_ioms)); fs0 = ((address >= ^h10000) & (address <= ^h17FFF) & (!_bms)); fs1 = ((address >= ^h18000) & (address <= ^h1FFFF) & (!_bms)); fs2 = ((address >= ^h20000) & (address <= ^h27FFF) & (!_bms)); fs3 = ((address >= ^h28000) & (address <= ^h2FFFF) & (!_bms)); fs4 = ((address >= ^h30000) & (address <= ^h37FFF) & (!_bms)); fs5 = ((address >= ^h38000) & (address <= ^h3FFFF) & (!_bms)); fs6 = ((address >= ^h40000) & (address <= ^h47FFF) & (!_bms)); fs7 = ((address >= ^h48000) & (address <= ^h4FFFF) & (!_bms)); csboot0 = ((address >= ^h50000) & (address <= ^h51FFF) & (!_bms)); csboot1 = ((address >= ^h52000) & (address <= ^h53FFF) & (!_bms)); csboot2 = ((address >= ^h54000) & (address <= ^h55FFF) & (!_bms)); csboot3 = ((address >= ^h56000) & (address <= ^h57FFF) & (!_bms)); Specifying these equations using PSDsoft ExpressTM is very simple. Figure 9 shows how to specify the equation for the 32K Byte Flash memory segment, fs2. Notice fs2 is qualified with the Figure 9. PSDsoft ExpressTM Memory Mapping signals BMS. This specification process is repeated for all other Flash memory segments, the csiop register block, and any external chip select signals that may be needed (ADC, etc.).
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RUNTIME CONTROL REGISTER DEFINITION There are up to 256 addresses decoded inside the DSM device for control and status information. 27 of these locations contain registers that the DSP can access at runtime. The base address of this block of 256 locations is referred to in this manual as csiop (Chip Select I/O Port). Table 4 lists the 27 registers and their offsets (in hexadecimal) from the csiop base address needed to access individual DSM control and status registers. The DSP will access these registers in I/O memory space using
its IOMS strobe. These registers are accesses in bytes, so the DSP should ignore the upper byte of its 16-bit I/O access. Note1: All csiop registers are cleared to logic 0 at reset. Note2: Do not write to unused locations within the csiop block of 256 registers. They should remain logic zero.
Table 4. CSIOP Registers and their Offsets (in hexadecimal)
Register Name Data In Data Out Port B 01 05 Port C 10 12 Port D 11 13 Other Description MCUI/O input mode. Read to obtain current logic level of Port pins. No writes. MCU I/O output mode. Write to set logic level on Port pins. Read to check status. MCU I/O mode. Configures Port pin as input or output. Write to set direction of Port pins. Logic 1 = out, Logic 0 = in. Read to check status. Write to configure Port pins as either standard CMOS or Open Drain on some pins, while selecting high slew rate on other pins. Read to check status. Read to obtain state of IMCs. No writes. 1B 20 21 Read to obtain the status of the output enable logic on each I/O Port driver. No writes. Read to get logic state of output of OMC bank AB. Write to load registers of OMC bank AB. Read to get logic state of output of OMC bank BC. Write to load registers of OMC bank BC. Write to set mask for loading OMCs in bank AB. A logic 1 in a bit position will block reads/writes of the corresponding OMC. A logic 0 will pass OMC value. Read to check status. Write to set mask for loading OMCs in bank BC. A logic 1 in a bit position will block reads/writes of the corresponding OMC. A logic 0 will pass OMC value. Read to check status. Read to determine Main Flash Sector Protection Setting. No writes. Read to determine if DSM devices Security Bit is active. Logic 1 = device secured. Also read to determine Secondary Flash Protection Setting status. No Writes. Write to enable JTAG Pins (optional feature). Read to check status. Power Management Register 0. Write and read. Power Management Register 2. Write and read. Memory Page Register. Write and read.
Direction
07
14
15
Drive Select Input Macrocells Enable Out Output Macrocells AB Output Macrocells BC
09 0B 0D
16 18 1A
17
Mask Macrocells AB
22
Mask Macrocells BC
23
Main Flash Sector Protection Security Bit and Secondary Flash Sector Protection JTAG Enable PMMR0 PMMR2 Page
C0
C2
C7 B0 B4 E0
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DETAILED OPERATION Figure 5 shows major functional areas of the device: s Flash Memories
s s s s s
PLDs (DPLD, CPLD, Page Register) DSP Bus Interface (Address, Data, Control) I/O Ports Runtime Control Registers JTAG ISP Interface
The following describes these functions in more detail. Flash Memories The Main Flash memory array is divided into eight equal 32K byte sectors. The Secondary Flash memory array is divided into four equal 8K byte sectors. Each sector is selected by the DPLD can be separately protected from program and erase cycles. This configuration is specified by using PSDsoft Express TM. Memory Sector Select Signals. The DPLD generates the Select signals for all the internal memory blocks (see Figure 14). Each of the twelve sectors of the Flash memories has a select signal (FS0-FS7, or CSBOOT0-CSBOOT3) which contains up to three product terms. Having three product terms for each select signal allows a given sector to be mapped into multiple areas of system memory if needed. Ready/Busy (PC3). This signal can be used to output the Ready/Busy status of the device. The output on Ready/Busy is a 0 (Busy) when either Flash memory array is being written, or when either Flash memory array is being erased. The output is a 1 (Ready) when no Write or Erase cycle is
in progress. This signal may be polled by the DSP or used as a DSP interrupt to indicate when an erase or program cycle is complete. Memory Operation. The Flash memories are accessed through the DSP Address, Data, and Control Bus Interface. DSPs and MCUs cannot write to Flash memory as it would an SRAM device. Flash memory must first be "unlocked" with a special sequence of byte write operations to invoke an internal algorithm, then a single data byte is written to the Flash memory array, then programming status is checked by a byte read operation or by checking the Ready/ Busy pin (PC3). Table 5 lists all of the special instruction sequences to program (write) data to the Flash memory arrays, erase the arrays, and check for different types of status from the arrays. These instruction sequences are different combinations of individual byte write and byte read operations. IMPORTANT: The DSP may not read and execute code from the same Flash memory array for which it is directing an instruction sequence. Or more simply stated, the DSP may not read code the same Flash array that is writing or erasing. Instead, the DSP must execute code from an alternate memory (like its own internal SRAM or a different Flash array) while sending instructions to a given Flash array. Since the two Flash memory arrays inside the DSM device are completely independent, the DSP may read code from one array while sending instructions to the other. After a Flash memory array is programmed (written) it will go to "Read Array" mode, then the DSP can read from Flash memory just as if would from any 8-bit ROM or SRAM device.
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Table 5. Instruction Sequences1,2,3,4
Instruction Sequence Read Memory Contents5 Read Flash Identifier (Main Flash only)6,7 Read Memory Sector Protection Status6,7,8 Program a Flash Byte Flash Bulk Erase9 Flash Sector Erase10 Suspend Sector Erase11 Cycle 1 Read byte from any valid Flash memory addr Write AAh to XX555h Write 55h to XXAAAh Write 90h to XX555h Read identifier with addr lines A6,A1,A0 = 0,0,1 Read identifier with addr lines A6,A1,A0 = 0,1,0 Write (program) data to addr Write AAh to XX555h Write AAh to XX555h Write 55h to XXAAAh Write 55h to XXAAAh Write 10h to XX555h Write 30h to another Sector Write 30h to another Sector Cycle 2 Cycle 3 Cycle 4 Cycle 5 Cycle 6 Cycle 7
Write AAh to XX555h
Write 55h to XXAAAh
Write 90h to XX555h
Write AAh to XX555h Write AAh to XX555h Write AAh to XX555h Write B0h to address that activates any of FS0 - FS7 Write 30h to addr that activates any of FS0 - FS7 Write F0h to address that activates any of FS0 - FS7
Write 55h to XXAAAh Write 55h to XXAAAh Write 55h to XXAAAh
Write A0h to XX555h Write 80h to XX555h Write 80h to XX555h
Resume Sector Erase12
Reset Flash
6
Note: 1. All values are in hexadecimal, X = Don't Care 2. A desired internal Flash memory sector select signal (FS0 - FS7 or CSBOOT0 - CSBOOT3) must be active for each write or read cycle. Only one of these sector select signals will be active at any given time depending on the address presented by the DSP and the memory mapping defined in PSDsoft Express. FS0 - FS7 and CSBOOT0-CSBOOT3 are active high logic internally. 3. DSP addresses A18 through A12 are Don't Care during the instruction sequence decoding. Only address bits A11-A0 are used during Flash memory instruction sequence decoding bus cycles. The individual sector select signal (FS0 - FS7 or CSBOOT0CSBOOT3) which is active during the instruction sequences determines the complete address. 4. For write operations, addresses are latched on the falling edge of Write Strobe (WR, CNTL0), Data is latched on the rising edge of Write Strobe (WR, CNTL0) 5. No Unlock or Instruction cycles are required when the device is in the Read Array mode. Operation is like reading a ROM device. 6. The Reset Flash instruction is required to return to the normal Read Array mode if the Error Flag (DQ5) bit goes High, or after reading the Flash Identifier or after reading the Sector Protection Status. 7. The DSP cannot invoke this instruction sequence while executing code from the same Flash memory as that for which the instruction sequence is intended. The DSP must fetch, for example, the code from the DSP SRAM when reading the Flash memory Identifier or Sector Protection Status. 8. The data is 00h for an unprotected sector, and 01h for a protected sector. In the fourth cycle, the Sector Select is active, and (A1,A0)=(1,0) 9. Directing this command to any individual active Flash memory segment (FS0 - FS7) will invoke the bulk erase of all eight Flash memory sectors. 10. DSP writes command sequence to initial segment to be erased, then writes the byte 30h to additional sectors to be erased. The byte 30h must be addressed to one of the other Flash memory segments (FS0 - FS7) for each additional segment (write 30h to any address within a desired sector). No more than 80uS can elapse between subsequent additional sector erase commands. 11. The system may perform Read and Program cycles in non-erasing sectors, read the Flash ID or read the Sector Protect Status, when in the Suspend Sector Erase mode. The Suspend Sector Erase instruction sequence is valid only during a Sector Erase cycle. 12. The Resume Sector Erase instruction sequence is valid only during the Suspend Sector Erase mode.
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Instruction Sequences An instruction sequence consists of a sequence of specific write or read operations. Each byte written to the device is received and sequentially decoded and not executed as a standard write operation to the memory array. The instruction sequence is executed when the correct number of bytes are properly received and the time between two consecutive bytes is shorter than the time-out period. Some instruction sequences are structured to include read operations after the initial write operations. The instruction sequence must be followed exactly. Any invalid combination of instruction bytes or time-out between two consecutive bytes while addressing Flash memory resets the device logic into Read Array mode (Flash memory is read like a ROM device). The device supports the instruction sequences summarized in Table 5: Flash memory: s Erase memory by chip or sector
s s s s s
Suspend or resume sector erase Program a Byte Reset to Read Array mode Read primary Flash Identifier value Read Sector Protection Status
These instruction sequences are detailed in Table 5. For efficient decoding of the instruction sequences, the first two bytes of an instruction sequence are the coded cycles and are followed by an instruction byte or confirmation byte. The coded cycles consist of writing the data AAh to address XX555h during the first cycle and data 55h to address XXAAAh during the second cycle. Address signals A18-A12 are Don't Care during the instruction sequence Write cycles. However, the appropriate internal Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) must be selected internally (active, which is logic 1).
Reading Flash Memory Under typical conditions, the DSP may read the Flash memory using read operations just as it would a ROM or RAM device. Alternately, the DSP may use read operations to obtain status information about a Program or Erase cycle that is currently in progress. Lastly, the DSP may use instruction sequences to read special data from these memory blocks. The following sections describe these read instruction sequences. Read Memory Contents. Flash memory is placed in the Read Array mode after Power-up, chip reset, or a Reset Flash memory instruction sequence (see Table 5). The DSP can read the memory contents of the Flash memory by using read operations any time the read operation is not part of an instruction sequence. Read Main Flash Identifier. The Main Flash memory identifier is read with an instruction sequence composed of 4 operations: 3 specific write operations and a read operation (see Table 5). During the read operation, address bits A6, A1, and A0 must be 0,0,1, respectively, and the appropriate internal Sector Select (FS0-FS7) must be active. The identifier is 0xE7. Not Applicable to Secondary Flash. Read Memory Sector Protection Status. The Flash memory Sector Protection Status is read with an instruction sequence composed of 4 operations: 3 specific write operations and a read operation (see Table 5). During the read operation, address bits A6, A1, and A0 must be 0,1,0, respectively, while internal Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) designates the Flash memory sector whose protection has to be verified. The read operation produces 01h if the Flash memory sector is protected, or 00h if the sector is not protected. The sector protection status can also be read by the DSP accessing the Flash memory Protection registers in csiop space. See the section entitled "Flash Memory Sector Protect" for register definitions.
Table 6. Status Bit Definition
Functional Block FS0-FS7, or CSBOOT0-CSBOOT3 Active (the desired segment is selected) DQ7 Data Polling DQ6 Toggle Flag DQ5 Error Flag DQ4 DQ3 Erase Timeout DQ2 DQ1 DQ0
Flash Memory
X
X
X
X
Note: 1. X = Not guaranteed value, can be read either 1 or 0. 2. DQ7-DQ0 represent the Data Bus bits, D7-D0.
Reading the Erase/Program Status Bits. The device provides several status bits to be used by the DSP to confirm the completion of an Erase or
Program cycle of Flash memory. These status bits minimize the time that the DSP spends performing these tasks and are defined in Table 6. The status bits can be read as many times as needed.
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For Flash memory, the DSP can perform a read operation to obtain these status bits while an Erase or Program instruction sequence is being executed by the embedded algorithm. See the section entitled "Programming Flash Memory", on page 19, for details. Data Polling Flag (DQ7). When erasing or programming in Flash memory, the Data Polling Flag (DQ7) bit outputs the complement of the bit being entered for programming/writing on the Data Polling Flag (DQ7) bit. Once the Program instruction sequence or the write operation is completed, the true logic value is read on the Data Polling Flag (DQ7) bit (in a read operation). Flash memory instruction features. s Data Polling is effective after the fourth Write pulse (for a Program instruction sequence) or after the sixth Write pulse (for an Erase instruction sequence). It must be performed at the address being programmed or at an address within the Flash memory sector being erased.
s s
If the byte to be programmed belongs to a protected Flash memory sector, the instruction sequence is ignored. If all the Flash memory sectors selected for erasure are protected, the Toggle Flag (DQ6) bit toggles to 0 for about 100 s and then returns to the previous addressed byte.
s
During an Erase cycle, the Data Polling Flag (DQ7) bit outputs a 0. After completion of the cycle, the Data Polling Flag (DQ7) bit outputs the last bit programmed (it is a 1 after erasing). If the byte to be programmed is in a protected Flash memory sector, the instruction sequence is ignored. If all the Flash memory sectors to be erased are protected, the Data Polling Flag (DQ7) bit is reset to 0 for about 100 s, and then returns to the previous addressed byte. No erasure is performed.
s
s
Toggle Flag (DQ6). The device offers another way for determining when the Flash memory Program cycle is completed. During the internal write operation and when the Sector Select FS0-FS7 (or CSBOOT0-CSBOOT3) is true, the Toggle Flag (DQ6) bit toggles from 0 to 1 and 1 to 0 on subsequent attempts to read any byte of the memory. When the internal cycle is complete, the toggling stops and the data read on the Data Bus D0-7 is the addressed memory byte. The device is now accessible for a new read or write operation. The cycle is finished when two successive reads yield the same output data. Flash memory specific features: s The Toggle Flag (DQ6) bit is effective after the fourth write operation (for a Program instruction sequence) or after the sixth write operation (for an Erase instruction sequence).
Error Flag (DQ5). During a normal Program or Erase cycle, the Error Flag (DQ5) bit is to 0. This bit is set to 1 when there is a failure during Flash memory Byte Program, Sector Erase, or Bulk Erase cycle. In the case of Flash memory programming, the Error Flag (DQ5) bit indicates the attempt to program a Flash memory bit from the programmed state, 0, to the erased state, 1, which is not valid. The Error Flag (DQ5) bit may also indicate a Time-out condition while attempting to program a byte. In case of an error in a Flash memory Sector Erase or Byte Program cycle, the Flash memory sector in which the error occurred or to which the programmed byte belongs must no longer be used. Other Flash memory sectors may still be used. The Error Flag (DQ5) bit is reset after a Reset Flash instruction sequence. Erase Time-out Flag (DQ3). The Erase Timeout Flag (DQ3) bit reflects the time-out period allowed between two consecutive Sector Erase instruction sequence bytes. The Erase Time-out Flag (DQ3) bit is reset to 0 after a Sector Erase cycle for a time period of 100 s + 20% unless an additional Sector Erase instruction sequence is decoded. After this time period, or when the additional Sector Erase instruction sequence is decoded, the Erase Time-out Flag (DQ3) bit is set to 1. Programming Flash Memory When a byte of Flash memory is programmed, individual bits are programmed to logic 0. You cannot program a bit in Flash memory to a logic 1 once it has been programmed to a logic 0. A bit must be erased to logic 1, and programmed to logic 0. That means Flash memory must be erased prior to being programmed. A byte of Flash memory is erased to all 1s (FFh). The DSP may erase the entire Flash memory array all at once or individual sector-by-sector, but not byte-by-byte. However, the DSP may program Flash memory byte-by-byte. The Flash memory requires the DSP to send an instruction sequence to program a byte or to erase sectors (see Table 5). Once the DSP issues a Flash memory Program or Erase instruction sequence, it must check for the status bits for completion. The embedded algorithms that are invoked inside the device provide several ways give status to the DSP. Status may
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be checked using any of three methods: Data Polling, Data Toggle, or Ready/Busy (pin PC3). Data Polling. Polling on the Data Polling Flag (DQ7) bit is a method of checking whether a Program or Erase cycle is in progress or has completed. Figure 10 shows the Data Polling algorithm. When the DSP issues a Program instruction sequence, the embedded algorithm within the device begins. The DSP then reads the location of the byte to be programmed in Flash memory to check status. The Data Polling Flag (DQ7) bit of this location becomes the compliment of bit 7 of the original data byte to be programmed. The DSP continues to poll this location, comparing the Data Polling Flag (DQ7) bit and monitoring the Error Flag (DQ5) bit. When the Data Polling Flag (DQ7) bit matches bit7 of the original data, and the Error Flag (DQ5) bit remains 0, then the embedded algorithm is complete. If the Error Flag (DQ5) bit is 1, the DSP should test the Data Polling Flag (DQ7) bit again since the Data Polling Flag (DQ7) bit may have changed simultaneously with the Error Flag (DQ5) bit (see Figure 10). The Error Flag (DQ5) bit is set if either an internal time-out occurred while the embedded algorithm attempted to program the byte or if the DSP attempted to program a 1 to a bit that was not erased (not erased is logic 0). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed, to compare the byte that was written to the Flash memory with the byte that was intended to be written. When using the Data Polling method during an Erase cycle, Figure 10 still applies. However, the Data Polling Flag (DQ7) bit is 0 until the Erase cycle is complete. A 1 on the Error Flag (DQ5) bit indicates a time-out condition on the Erase cycle, a 0 indicates no error. The DSP can read any location within the sector being erased to get the Data Polling Flag (DQ7) bit and the Error Flag (DQ5) bit. PSDsoft Express generates ANSI C code functions which implement these Data Polling algorithms. Figure 10. Data Polling Flowchart
START
READ DQ5 & DQ7 at VALID ADDRESS
DQ7 = DATA NO NO
YES
DQ5 =1 YES READ DQ7
DQ7 = DATA NO FAIL
YES
PASS
AI01369B
Data Toggle. Checking the Toggle Flag (DQ6) bit is a method of determining whether a Program or Erase cycle is in progress or has completed. Figure 11 shows the Data Toggle algorithm. When the DSP issues a Program instruction sequence, the embedded algorithm within the device begins. The DSP then reads the location of the byte to be programmed in Flash memory to check status. The Toggle Flag (DQ6) bit of this location toggles each time the DSP reads this location until the embedded algorithm is complete. The DSP continues to read this location, checking the Toggle Flag (DQ6) bit and monitoring the Error Flag (DQ5) bit. When the Toggle Flag (DQ6) bit stops toggling (two consecutive reads yield the same value), and the Error Flag (DQ5) bit remains 0, then the embedded algorithm is complete. If the Error Flag (DQ5) bit is 1, the DSP should test the Toggle Flag (DQ6) bit again, since the Toggle Flag (DQ6) bit may have changed simultaneously with the Error Flag (DQ5) bit (see Figure 11).
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Figure 11. Data Toggle Flowchart
START
READ DQ5 & DQ6
DQ6 = TOGGLE YES NO
NO
DQ5 =1 YES READ DQ6
DQ6 = TOGGLE YES FAIL
NO
PASS
AI01370B
The Error Flag (DQ5) bit is set if either an internal time-out occurred while the embedded algorithm attempted to program the byte, or if the DSP attempted to program a 1 to a bit that was not erased (not erased is logic 0). It is suggested (as with all Flash memories) to read the location again after the embedded programming algorithm has completed, to compare the byte that was written to Flash memory with the byte that was intended to be written. When using the Data Toggle method after an Erase cycle, Figure 11 still applies. the Toggle Flag (DQ6) bit toggles until the Erase cycle is complete. A 1 on the Error Flag (DQ5) bit indicates a time-out condition on the Erase cycle, a 0 indicates no error. The DSP can read any location within the sector being erased to get the Toggle Flag (DQ6) bit and the Error Flag (DQ5) bit. PSDsoft Express generates ANSI C code functions which implement these Data Toggling algorithms. Erasing Flash Memory Flash Bulk Erase. The Flash Bulk Erase instruction sequence uses six write operations followed by a read operation of the status register, as described in Table 5. If any byte of the Bulk Erase instruction sequence is wrong, the Bulk Erase instruction sequence aborts and the device is re-
set to the Read Flash memory status. The Bulk Erase command may be addresses to any one individual valid Flash memory segment (FS0-FS7 or CSBOOT0-CSBOOT3) and the entire array (all segments in one array) will be erased. During a Bulk Erase, the memory status may be checked by reading the Error Flag (DQ5) bit, the Toggle Flag (DQ6) bit, and the Data Polling Flag (DQ7) bit, as detailed in the section entitled "Programming Flash Memory", on page 19. The Error Flag (DQ5) bit returns a 1 if there has been an Erase Failure (maximum number of Erase cycles have been executed). It is not necessary to program the memory with 00h because the device automatically does this before erasing to 0FFh. During execution of the Bulk Erase instruction sequence, the Flash memory does not accept any instruction sequences. The address provided with the Flash Bulk Erase command sequence (Table 5) may select any one of the eight internal Flash memory Sector Select signals FS0 - FS7 or one of the four signals CSBOOT0-CSBOOT3. An erase of that entire Flash memory array will occur even though the command was sent to just one Flash memory sector. Flash Sector Erase. The Sector Erase instruction sequence uses six write operations, as described in Table 5. Additional Flash Sector Erase codes and Flash memory sector addresses can be written subsequently to erase other Flash memory sectors in parallel, without further coded cycles, if the additional bytes are transmitted in a shorter time than the time-out period of about 100 s. The input of a new Sector Erase code restarts the timeout period. The status of the internal timer can be monitored through the level of the Erase Time-out Flag (DQ3) bit. If the Erase Time-out Flag (DQ3) bit is 0, the Sector Erase instruction sequence has been received and the time-out period is counting. If the Erase Time-out Flag (DQ3) bit is 1, the time-out period has expired and the device is busy erasing the Flash memory sector(s). Before and during Erase time-out, any instruction sequence other than Suspend Sector Erase and Resume Sector Erase instruction sequences abort the cycle that is currently in progress, and reset the device to Read Array mode. It is not necessary to program the Flash memory sector with 00h as the device does this automatically before erasing (byte=FFh). During a Sector Erase, the memory status may be checked by reading the Error Flag (DQ5) bit, the Toggle Flag (DQ6) bit, and the Data Polling Flag (DQ7) bit, as detailed in the section entitled "Programming Flash Memory", on page 19.
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During execution of the Erase cycle, the Flash memory accepts only Reset and Suspend Sector Erase instruction sequences. Erasure of one Flash memory sector may be suspended, in order to read data from another Flash memory sector, and then resumed. The address provided with the initial Flash Sector Erase command sequence (Table 5) must select the first desired sector (FS0 - FS7 or CSBOOT0CSBOOT3) to erase. Subsequent sector erase commands that are appended on within the timeout period must be addressed to other desired segments (FS0 - FS7 or CSBOOT0-CSBOOT3). Suspend Sector Erase. When a Sector Erase cycle is in progress, the Suspend Sector Erase instruction sequence can be used to suspend the cycle by writing 0B0h to any address when an appropriate Sector Select (FS0-FS7 or CSBOOT0CSBOOT3) is selected (See Table 5). This allows reading of data from another Flash memory sector after the Erase cycle has been suspended. Suspend Sector Erase is accepted only during an Erase cycle and defaults to Read mode. A Suspend Sector Erase instruction sequence executed during an Erase time-out period, in addition to suspending the Erase cycle, terminates the time out period. The Toggle Flag (DQ6) bit stops toggling when the device internal logic is suspended. The status of this bit must be monitored at an address within the Flash memory sector being erased. The Toggle Flag (DQ6) bit stops toggling between 0.1 s and 15 s after the Suspend Sector Erase instruction sequence has been executed. The device is then automatically set to Read mode. If an Suspend Sector Erase instruction sequence was executed, the following rules apply: - Attempting to read from a Flash memory sector that was being erased outputs invalid data. - Reading from a Flash memory sector that was not being erased is valid. - The Flash memory cannot be programmed, and only responds to Resume Sector Erase and Reset Flash instruction sequences (Read is an operation and is allowed). - If a Reset Flash instruction sequence is received, data in the Flash memory sector that was being erased is invalid. Resume Sector Erase. If a Suspend Sector Erase instruction sequence was previously executed, the erase cycle may be resumed with this instruction sequence. The Resume Sector Erase instruction sequence consists of writing 030h to any address while an appropriate Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) is active. (See Table 5.) Flash Memory Sector Protect. Each Flash memory sector can be separately protected against Program and Erase cycles. Sector Protection provides additional data security because it disables all Program or Erase cycles. This mode can be activated through the JTAG Port or a Device Programmer. Sector protection can be selected for each sector using PSDsoft Express. This automatically protects selected sectors when the device is programmed through the JTAG Port or a Device Programmer. Flash memory sectors can be unprotected to allow updating of their contents using the JTAG Port or a Device Programmer. The DSP can read (but cannot change) the sector protection bits. Any attempt to program or erase a protected Flash memory sector is ignored by the device. The Verify operation results in a read of the protected data. This allows a guarantee of the retention of the Protection status. The sector protection status can be read by the DSP through the Main Flash memory protection register (in the csiop block) as defined in Table 7, and Secondary Flash memory protection register in Table 8.
Table 7. Main Flash Memory Protection Register Definition
Bit 7 Sec7_Prot Bit 6 Sec6_Prot Bit 5 Sec5_Prot Bit 4 Sec4_Prot Bit 3 Sec3_Prot Bit 2 Sec2_Prot Bit 1 Sec1_Prot Bit 0 Sec0_Prot
Note: Bit Definitions: Sec_Prot 1 = Flash memory sector is write protected. Sec_Prot 0 = Flash memory sector is not write protected.
Table 8. Secondary Flash Memory Protection/Security Bit Register Definition
Bit 7 Security_Bit Bit 6 not used Bit 5 not used Bit 4 not used Bit 3 Sec3_Prot Bit 2 Sec2_Prot Bit 1 Sec1_Prot Bit 0 Sec0_Prot
Note: Security_Bit = 1, device is secured. Note: Sec_Prot 1 = Flash memory sector is write protected. Sec_Prot 0 = Flash memory sector is not write protected.
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DSM Security Bit A programmable security bit in the DSM protects its contents from unauthorized viewing and copying. When set, the security bit will block access of programming devices (JTAG or others) to the DSM Flash memory and PLD configuration. The only way to defeat the security bit is to erase the entire DSM device, after which the device is blank and may be used again. The DSP will always have access to Flash memory contents through the 8-bit data port even while the security bit is set. The DSP can read the status of the security bit (but it cannot change it) by reading the Device Security register in the csiop block as defined in Table 8. Reset Flash The Reset Flash instruction sequence resets the internal memory logic state machine and puts Flash memory into Read Array mode. It consists of one write cycle (see Table 5). It must be executed after: - Reading the Flash Protection Status or Flash ID - An Error condition has occurred (and the device has set the Error Flag (DQ5) bit to 1) during a Flash memory Program or Erase cycle. The Reset Flash instruction sequence puts the Flash memory back into normal Read Array mode. It may take the Flash memory up to a few milliseconds to complete the Reset cycle. The Reset Flash instruction sequence is ignored when it is issued during a Program or Bulk Erase cycle of the Flash memory. The Reset Flash instruction sequence aborts any on-going Sector Erase cycle, and returns the Flash memory to the normal Read Array mode within a few milliseconds. Page Register The 8-bit Page Register increases the addressing capability of the DSP by a factor of up to 256. The contents of the register can also be read by the DSP. The outputs of the Page Register (PG0PG7) are inputs to the DPLD decoder and can be included in the Sector Select (FS0-FS7 or CSBOOT0-CSBOOT3) equations. See Figure 12. If memory paging is not needed, or if not all 8 page register bits are needed for memory paging, then these bits may be used in the CPLD for general logic. The eight flip-flops in the register are connected to the internal data bus D0-D7. The DSP can write to or read from the Page Register. The Page Register can be accessed at address location csiop + E0h. Page Register outputs are cleared to logic 0 at reset. Figure 12. Page Register
RESET
D0 D1 D0 - D7 D2 D3 D4 D5 D6 R/W D7
Q0 Q1 Q2 Q3 Q4 Q5
PGR0 PGR1 PGR2 PGR3 PGR4 PGR5 PGR6 DPLD AND CPLD
INTERNAL SELECTS AND LOGIC
Q6 PGR7 Q7
PAGE REGISTER
PLD
PLDs The PLDs bring programmable logic to the device. After specifying the logic for the PLDs using PSDsoft Express, the logic is programmed into the device and available upon Power-up. The PLDs have selectable levels of performance and power consumption. The device contains two PLDs: the Decode PLD (DPLD), and the Complex PLD (CPLD), as shown in Figure 13. Table 9. DPLD and CPLD Inputs
Input Source DSP Address Bus1 DSP Control Signals2 Reset PortB Input Macrocells PortC Input Macrocells Port D Inputs Page Register Macrocell AB Feedback Macrocell BC Feedback Flash memory Program Status Bit Input Name A15-A0 CNTL2-CNTL0 RST PB7-PB0 PC7-PC0 PD2-PD0 PG7-PG0 MCELLAB FB7-0 MCELLBC FB7-0 Ready/Busy Number of Signals 16 3 1 8 8 3 8 8 8 1
Note: 1. DSP address lines A16, A17, and others may enter the DSM device on any pin on ports B, C, or D. See Figure 6 for recommended connections. 2. Additional DSP control signals may enter the DMS device on any pin on Ports B, C, or D. See Figure 6 for recommended connections.
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The DPLD performs address decoding, and generates select signals for internal and external components, such as memory, registers, and I/O ports. The DPLD can generates External Chip Select (ECS0-ECS2) signals on Port D. The CPLD can be used for logic functions, such as loadable counters and shift registers, state machines, and encoding and decoding logic. These logic functions can be constructed using the 16 Output Macrocells (OMC), 16 Input Macrocells (IMC), and the AND Array. The AND Array is used to form product terms. These product terms are configured from the logic definition entered in PSDsoft Express. An Input Bus consisting of 64 signals is connected to the PLDs. Input signals are shown in Table 9. Figure 13. PLD Diagram Turbo Bit. The PLDs in the device can minimize power consumption by switching off when inputs remain unchanged for an extended time of about 70 ns. Resetting the Turbo bit to 0 (Bit 3 of the PMMR0 register) automatically places the PLDs into standby if no inputs are changing. Turning the Turbo mode off increases propagation delays while reducing power consumption. Additionally, five bits are available in the PMMR registers in csiop to block DSP control signals from entering the PLDs. This reduces power consumption and can be used only when these DSP control signals are not used in PLD logic equations. Each of the two PLDs has unique characteristics suited for its applications. They are described in the following sections.
8
PAGE REGISTER
Data Bus
64
DECODE PLD (DPLD)
8 4
Main Flash Memory Selects Secondary Flash Memory Selects
1 3 1
CSIOP Select External Chip Selects to Port D JTAG Select
PLD INPUT BUS
16
Output Macrocell Feedback
Direct Macrocell Access from MCU Data Bus
CPLD
PT ALLOC.
16 Output Macrocell
Macrocell Alloc.
MCELLAB to PORT B
8
16 Input Macrocell (PORT B,C)
Direct Macrocell Input to MCU Data Bus 16 Input Macrocell and Input Ports
3
PORT D Inputs
AI04957B
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I/O PORTS
64
MCELLBC to PORT B or C 8
DSM2190F4
DECODE PLD (DPLD) The DPLD, shown in Figure 14, is used for decoding the address for internal and external components. The DPLD can be used to generate the following decode signals: s 8 Main Flash memory Sector Select (FS0-FS7) signals with three product terms each
s
s
1 internal csiop select for DSM device control and status registers (csiop is the base address of the block of 256 byte locations) 1 JTAG Select signal (enables JTAG operations on Port C when multiplexing JTAG signals with general I/O signals) 3 external chip select output signals for Port D pins, each with one product term.
s
4 Secondary Flash memory Sector Select (CSBOOT0-CSBOOT3) signals with three product terms each
s
Figure 14. DPLD Logic Array
3 3 3 3 (INPUTS) I/O PORTS (PORT A, B,C) MCELLAB.FB [ :0] (Feedback) 7 MCELLBC.FB [ :0] (Feedback 7 ) PG0-PG7 A[15:0] PD[2:0] (16) 3 (8) 3 (8) 3 (8) 3 (16) 3 (3) 3 CNTRL[2:0] (Read/Write Control Signals)(3) 3 RESET RD_BSY (1) (1) 1 1 1 1 1 CSIOP JTAGSEL ECS0 ECS1 ECS2
AI04958
CSBOOT0 CSBOOT1 CSBOOT2 CSBOOT3 FS0 FS1 FS2 FS3 FS4 FS5 FS6 FS7 8 Flash Main Memory Sector Selects 4 Secondary Flash Memory Sector Selects
3
I/O Decoder Select JTAG ISP
External Chip Selects to PORT D
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COMPLEX PLD (CPLD) The CPLD can be used to implement system logic functions, such as loadable counters and shift registers, system mailboxes, handshaking protocols, state machines, and random logic. See application note AN1171 for details on how to specify logic using PSDsoft Express. As shown in Figure 15, the CPLD has the following blocks: s 16 Input Macrocells (IMC)
s s s s
s
Two I/O Ports.
16 Output Macrocells (OMC) Macrocell Allocator Product Term Allocator AND Array capable of generating up to 130 product terms
Each of the blocks are described in the sections that follow. The Input Macrocells (IMC) and Output Macrocells (OMC) are connected to the device internal data bus and can be directly accessed by the DSP. This enables the DSP software to load data into the Output Macrocells (OMC) or read data from both the Input and Output Macrocells (IMC and OMC). This feature allows efficient implementation of system logic and eliminates the need to connect the data bus to the AND Array as required in most standard PLD macro cell architectures.
Figure 15. Macrocell and I/O Port
PLD INPUT BUS Product Terms from other MacrocellS DSP ADDRESS / DATA BUS TO OTHER I/O PORTS
CPLD Macrocells
PT PRESET PRODUCT TERM ALLOCATOR MCU DATA IN MCU LOAD DATA LOAD CONTROL
I/O PORTS
LATCHED ADDRESS OUT DATA WR
I/O Pin
D Q MUX
AND ARRAY
UP TO 10 PRODUCT TERMS Macrocell Out to MCU CPLD OUTPUT
PR DI LD PT CLOCK D/T MUX Q COMB. /REG SELECT CPLD OUTPUT Macrocell to I/O Port Alloc. WR PT CLEAR PDR INPUT SELECT
PLD INPUT BUS
GLOBAL CLOCK CLOCK SELECT
D/T/JK FF SELECT CK CL
MUX
POLARITY SELECT
D
Q DIR REG.
PT Output Enable (OE) Macrocell Feedback I/O Port Input
Input Macrocells
MUX QD
QD PT INPUT LATCH GATE/CLOCK G
AI04902B
Output Macrocell (OMC). Eight of the Output Macrocells (OMC) are connected to Port B pins and are named as McellAB0-McellAB7. The other eight Macrocells are connected to Ports B or C pins and are named as McellBC0-McellBC7. OMCs may be used for internal feedback only (buried registers), or their outputs may be routed to external Port pins.
The Output Macrocell (OMC) architecture is shown in Figure 17. As shown in the figure, there are native product terms available from the AND Array, and borrowed product terms available (if unused) from other Output Macrocells (OMC). The polarity of the product term is controlled by the XOR gate. The Output Macrocell (OMC) can implement either sequential logic, using the flip-flop
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element, or combinatorial logic. The multiplexer selects between the sequential or combinatorial logic outputs. The multiplexer output can drive a port pin and has a feedback path to the AND Array inputs. The flip-flop in the Output Macrocell (OMC) block can be configured as a D, T, JK, or SR type in PSDsoft ExpressTM. The flip-flop's clock, preset, and clear inputs may be driven from a product term of the AND Array. Alternatively, CLKIN (PD1) can be used for the clock input to the flip-flop. The flip-flop is clocked on the rising edge of CLKIN (PD1). The preset and clear are active High inputs. Each clear input can use up to two product terms. Output Macrocell Allocator. Outputs of the 16 OMCs can be routed to a combination of pins on Port B or Port D as shown in Figure 16. The OMC output pin is automatically determined by choosing pin functions in PSDsoft ExpressTM. Routing can occur on a bit-by-bit basis, spitting assignment between the Ports. However, one OMC can be routed to one Port pin only, not both. Figure 16. OMC Allocator
PORT B PINS 76543210
PORT C PINS 76543210
76543210 OMCs (MCELLAB)
76543210 OMCs (MCELLBC)
AI04915
Table 10. Output Macrocell Port and Data Bit Assignments
Output Macrocell McellAB0 McellAB1 McellAB2 McellAB3 McellAB4 McellAB5 McellAB6 McellAB7 McellBC0 McellBC1 McellBC2 McellBC3 McellBC4 McellBC5 McellBC6 McellBC7 Port Assignment Port B0 Port B1 Port B2 Port B3 Port B4 Port B5 Port B6 Port B7 Port B0 or C0 Port B1 or C1 Port B or, C2 Port B3 orC3 Port B4 orC4 Port B5 or C5 Port B6 orC6 Port B7 orC7 Native Product Terms 3 3 3 3 3 3 3 3 4 4 4 4 4 4 4 4 Maximum Borrowed Product Terms 6 6 6 6 6 6 6 6 5 5 5 5 6 6 6 6 Data Bit for Loading or Reading D0 D1 D2 D3 D4 D5 D6 D7 D0 D1 D2 D3 D4 D5 D6 D7
Product Term Allocator. The CPLD has a Product Term Allocator. PSDsoft ExpressTM uses the Product Term Allocator to borrow and place product terms from one Macrocell to another. This happens automatically in PSDsoft ExpressTM, but understanding how allocation works will help you if your logic design does not "fit", in which case you may try selecting a different pin or different OMC where the allocation resources may differ and the
design will then fit. The following list summarizes how product terms are allocated: s McellAB0-McellAB7 all have three native product terms and may borrow up to six more
s
McellBC0-McellBC3 all have four native product terms and may borrow up to five more McellBC4-McellBC7 all have four native product terms and may borrow up to six more.
s
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Each Macrocell may only borrow product terms from certain other Macrocells. Product terms already in use by one Macrocell are not available for another Macrocell. Product term allocation does not add any propagation delay to the logic. If an equation requires more product terms than are available to it through product term allocation, then "external" product terms are required, which consumes other Output Macrocells (OMC). This is called product term expansion and also happens automatically in PSDsoft ExpressTM as needed. Product tern expansion causes additional propagation delay because an OMC is consumed by the expansion and it's output is rerouted (or fed back) into the AND array. You can examine the fitter report generated by PSDsoft Express to see resulting product term allocation and product term expansion. Figure 17. CPLD Output Macrocell Loading and Reading the Output Macrocells (OMCs). Each of the two OMC blocks (8 OMCs each) occupies a memory location in the DSP address space, as defined in the csiop block MCELLAB0-7 and MCELLBC0-7 (see Table 4). The flip-flops in each of the 16 OMCs can be loaded from the data bus by a DSP. Loading the OMCs with data from the DSP takes priority over internal functions. As such, the preset, clear, and clock inputs to the flip-flop can be overridden by the DSP. The ability to load the flip-flops and read them back is useful in such applications as loadable counters and shift registers, mailboxes, and handshaking protocols. Data is loaded into the Output Macrocells (OMC) on the trailing edge of Write Strobe (WR, CNTL0).
MASK REG.
Output Macrocell CS RD
INTERNAL DATA BUS
D [ 7:0]
PT Allocator
WR Direction Register ENABLE (.OE) PRESET(.PR) COMB/REG SELECT
AND ARRAY
PT PT DIN PR
PLD INPUT BUS
MUX PT LD POLARITY SELECT CLEAR (.RE) PT CLK CLKIN MUX IN CLR Programmable FF (D / T/JK /SR) Port Driver Q Macrocell Allocator
I/O Pin
Feedback (.FB) Port Input Input Macrocell
AI04903B
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The OMC Mask Register. There is one Mask Register for each of the two groups of eight Output Macrocells (OMC). The Mask Registers can be used to block the loading of data to individual Output Macrocells (OMC). The default value for the Mask Registers is 00h, which allows loading of the Output Macrocells (OMC). When a given bit in a Mask Register is set to a 1, the DSP is blocked from writing to the associated Output Macrocells (OMC). For example, suppose McellAB0-3 are being used for a state machine. You would not want a DSP write to McellAB to overwrite the state machine registers. Therefore, you would want to load the Mask Register for McellAB (Mask Macrocell AB) with the value 0Fh. Figure 18. Input Macrocell
INTERNAL DATA BUS
The Output Enable of the OMC. The Output Macrocells (OMC) block can be connected to an I/ O port pin as a PLD output. The output enable of each port pin driver is controlled by a single product term from the AND Array, ORed with the Direction Register output. The pin is enabled upon Power-up if no output enable equation is defined and if the pin is declared as a PLD output in PSDsoft Express. If the Output Macrocell (OMC) output is specified as an internal node and not as a port pin output in the PSDsoft Express, then the port pin can be used for other I/O functions. The internal node feedback can be routed as an input to the AND Array.
INPUT MACROCELL _ RD ENABLE ( .OE ) OUTPUT Macrocells BC AND Macrocells AB
DIRECTION REGISTER
PT AND ARRAY
I/O Pin PT
PLD INPUT BUS
Port Driver
MUX
Q
D PT
D FF Feedback Q D G LATCH Input Macrocell
AI04904C
Input Macrocells (IMC). The CPLD has 16 Input Macrocells (IMC), one for each pin on Ports B and C. The architecture of the IMCs is shown in Figure 18. The IMCs are individually configurable, and can be used as a latch, a register, or to pass incoming Port signals prior to driving them onto the PLD input bus. This is useful for sampling and debouncing inputs to the AND array (keypad inputs, etc.). Additionally, the outputs of the IMCs can be read by the DSP asynchronously at any time
through the internal data bus using the csiop register block (see Table 4). The enable for the latch and clock for the register are driven by a product term from the CPLD. Each product term output is used to latch or clock four IMCs. Port inputs 3-0 can be controlled by one product term and 7-4 by another. Configurations for the IMCs are specified by equations specified in PSDsoft Express. See Application note AN1171.
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DSP Bus Interface The "no-glue logic" DSP Bus Interface allows direct connection. DSP address, data, and control signals connect directly to the DSM device. See Figure 6 for typical connections. DSP address, data and control signals are routed to Flash memory, I/O control (csiop), OMCs, and IMCs within the DMS. The DSP address range for each of these components is specified in PSDsoft Express TM. I/O Ports There are three programmable I/O ports: Ports B, C, and D. Each of the ports is eight bits except Port D, which is 3 bits. Each port pin is individually user configurable, thus allowing multiple functions per port. The ports are configured using PSDsoft ExFigure 19. General I/O Port Architecture
DATA OUT REG. D WR PORT PIN OUTPUT MUX Macrocell Outputs EXT CS INTERNAL DATA BUS READ MUX P D B DATA IN OUTPUT SELECT Q
pressTM or by the DSP writing to on-chip registers in the csiop block. The topics discussed in this section are: s General Port architecture
s s s s
Port operating modes Port Configuration Registers (PCR) Port Data Registers Individual Port functionality.
General Port Architecture. The general architecture of the I/O Port block is shown in Figure 19. Individual Port architectures are shown in Figure 20 to Figure 23. In general, once the purpose for a port pin has been defined in PSDsoft ExpressTM, that pin is no longer available for other purposes. Exceptions are noted.
DATA OUT
ENABLE OUT
DIR REG. D WR ENABLE PRODUCT TERM (.OE) Input Macrocell CPLD - INPUT
AI04905B
Q
As shown in Figure 19, the ports contain an output multiplexer whose select signals are driven by the configuration bits determined by PSDsoft Express. Inputs to the multiplexer include the following: s Output data from the Data Out register (for MCU I/O mode)
s
s
External Chip Selects ESC0-2 from the DPLD to Port D pins only.
CPLD Macrocell output (OMC)
The Port Data Buffer (PDB) is a tri-state buffer that allows only one source at a time to be read by the DSP. The Port Data Buffer (PDB) is connected to the Internal Data Bus for feedback and can be read by the DSP. The Data Out and Macrocell out-
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puts, Direction Registers, and port pin input are all connected to the Port Data Buffer (PDB). The Port pin's tri-state output driver enable is controlled by a two input OR gate whose inputs come from the CPLD AND Array enable product term and the Direction Register. If the enable product term of any of the Array outputs are not defined and that port pin is not defined as a CPLD output in PSDsoft Express TM, then the Direction Register has sole control of the buffer that drives the port pin. The contents of these registers can be altered by the DSP. The Port Data Buffer (PDB) feedback path allows the DSP to check the contents of the registers. Ports B, and C have embedded IMCs. The IMCs can be configured as registers (for sampling or deTable 11. Port Operating Modes
Port Mode MCU I/O PLD I/O McellAB Outputs McellBC Outputs Additional External CS Outputs PLD Inputs JTAG ISP
Note: 1. Can be multiplexed with other I/O functions.
bouncing), as transparent latches, or direct inputs to the PLDs. The registers and latches are clocked by a product term from the PLD AND Array. The outputs from the IMCs drive the PLD input bus and can be read by the DSP. See the section entitled "Input Macrocell", on page 29. Port Operating Modes The I/O Ports have several modes of operation. Modes are defined using PSDsoft ExpressTM, and then runtime control from the DSP can occur using the registers in the csiop block. See Application Note AN1171 for more detail. Table 11 summarizes which modes are available on each port. Each of the port operating modes are described in the following sections.
Port B Yes Yes Yes No Yes No
Port C Yes No Yes No Yes Yes1
Port D Yes No No Yes Yes No
MCU I/O Mode. In the MCU I/O mode, the DSP uses the I/O Ports block to expand its own I/O ports. The DSP can read I/O pins, set the direction of I/O pins, and change the state of I/O pins by accessing the registers in the csiop block. The csiop register definition and their addresses may be found in Table 4. The MCU I/O direction may be changed by writing to the corresponding bit in the Direction Register, or by the output enable product term. When the pin is configured as an output, the content of the Data Out Register drives the pin. When configured as an input, the DSP can read the port input through the Data In buffer. See Figure 19. PLD I/O Mode. Inputs from Ports B and C to either PLD (DPLD or CPLD) come through IMCs. Inputs from Port D to either PLDs are routed directly in and do not use IMCs. Outputs from the CPLD to Port B come from the OMC group MCELLAB0-7. Outputs from the CPLD to Port C come from OMC group MCELLBC0-7. Outputs from the DPLD to Port D come from the external chip select logic block ECS0-2. All PLD outputs may be tri-stated at the Port pins with a control signal. This output enable control signal can be defined by a product term from the
PLD, or by resetting the corresponding bit in the Direction Register to 0. The corresponding bit in the Direction Register must not be set to logic 1 by the DSP if the pin is defined for a PLD input signal in PSDsoft Express. The PLD I/O mode is defined in PSDsoft Express by specifying PLD equations. JTAG In-System Programming (ISP). Some of the pins on Port C are based on the IEEE 1194.1 JTAG specification and is used for In-System Programming (ISP). You can multiplex the function of these Port C JTAG pins with other functions. ISP is not performed very frequently in the life of the product, so multiplexing these pin's functions with general purpose I/O functions gives more utility from Port C. See the section entitled "Programming In-Circuit Using JTAG ISP", and Application Note AN1153. Port Configuration Registers (PCR). Each Port has a set of Port Configuration Registers (PCR) used for configuration of the pins. The contents of the registers can be accessed by the DSP through normal read/write bus cycles of the csiop registers listed in Table 4. The pins of a port are individually configurable and each bit in the register controls its respective pin. For example, Bit 0 in a register refers to Bit 0 of its
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port. The three Port Configuration Registers (PCR), are shown in Table 12. Default is logic 0. Table 12. Port Configuration Registers (PCR)
Register Name Data In Data Out Direction Drive Select
1
Table 14. Port Pin Direction Control, Output Enable P.T. Defined
Direction Register Bit 0 0 1 1 Output Enable P.T. 0 1 0 1 Port Pin Mode Input Output Output Output
Port B,C,D B,C,D B,C,D B,C,D
DSP Access Read Write/Read Write/Read Write/Read
Note: 1. See Table 16 for Drive Register bit definition.
Table 15. Port Direction Assignment Example
Bit 7 0 Bit 6 0 Bit 5 0 Bit 4 0 Bit 3 0 Bit 2 1 Bit 1 1 Bit 0 1
Data In Register. The DSP may read the Data In registers in the csiop block at any time to determine the logic state of a Port pin. This will be the state at the pin regardless of whether it is driven by a source external to the DSM or driven internally from the DSM device. Reading a logic zero for a bit in a Data In register means the corresponding Port pin is also at logic zero. Reading logic one means the pin is logic one. Each bit in a Data In register corresponds to an individual Port pin. For a given Port, bit 0 in a Data In register corresponds to pin 0 of the Port. Example, bit 0 of the Data In register for Port B corresponds to Port B pin PB0. Data Out Register. The DSP may write (or read) the Data Out register in the csiop block at any time. Writing the Data Out register will change the logic state of a Port pin only if it is not driven or controlled by the CPLD. Writing a logic zero to a bit in a Data Out register will force the corresponding Port pin to be logic zero. Writing logic one will drive the pin to logic one. Each bit in the Data Out registers correspond to Port pins the same way as the Data In registers described above. When some pins of a Port are driven by the CPLD, writing to the corresponding bit in a Data Out register will have no effect as the CPLD overrides the Data Out register. Direction Register. The Direction Register, in conjunction with the output enable (except for Port D), controls the direction of data flow in the I/O Ports. Any bit set to 1 in the Direction Register causes the corresponding pin to be an output, and any bit set to 0 causes it to be an input. The default mode for all port pins is input. Table 13. Port Pin Direction Control, Output Enable P.T. Not Defined
Direction Register Bit 0 1 Input Output Port Pin Mode
Figure 20 and Figure 21 show the Port Architecture diagrams for Ports B and C, respectively. The direction of data flow for Ports B, and C are controlled not only by the direction register, but also by the output enable product term from the PLD AND Array. If the output enable product term is not active, the Direction Register has sole control of a given pin's direction. An example of a configuration for a Port with the three least significant bits set to output and the remainder set to input is shown in Table 15. Since Port D only contains three pins (shown in Figure 23), the Direction Register for Port D has only the three least significant bits active. Drive Select Register. The Drive Select Register configures the pin driver as Open Drain or CMOS (standard push/pull) for some port pins, and controls the slew rate for the other port pins. An external pull-up resistor should be used for pins configured as Open Drain. Open Drain outputs are diode clamped, thus the maximum voltage on an pin configured as Open Drain is Vcc + 0.7V. A pin can be configured as Open Drain if its corresponding bit in the Drive Select Register is set to a 1. The default pin drive is CMOS. Note that the slew rate is a measurement of the rise and fall times of an output. A higher slew rate means a faster output response and may create more electrical noise. A pin operates in a high slew rate when the corresponding bit in the Drive Register is set to 1. The default rate is standard slew. Table 16 shows the Drive Register for Ports B, C, and D. It summarizes which pins can be configured as Open Drain outputs and which pins the slew rate can be set for.
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Table 16. Drive Register Pin Assignment
Drive Register Port B Port C Port D Bit 7 Open Drain Open Drain NA 1 Bit 6 Open Drain Open Drain NA1 Bit 5 Open Drain Open Drain NA1 Bit 4 Open Drain Open Drain NA1 Bit 3 Slew Rate Open Drain NA1 Bit 2 Slew Rate Open Drain Slew Rate Bit 1 Slew Rate Open Drain Slew Rate Bit 0 Slew Rate Open Drain Slew Rate
Note: 1. NA = Not Applicable.
Figure 20. Port B Structure
DATA OUT REG. D WR Q
DATA OUT
PORT B PIN OUTPUT MUX MACROCELL OUTPUTS READ MUX P D B DATA IN OUTPUT SELECT
INTERNAL DATA BUS
ENABLE OUT
DIR REG. D WR ENABLE PRODUCT TERM (.OE) Input Macrocell Q
CPLD - INPUT
AI04906B
Port B - Functionality and Structure Port B can be configured to perform one or more of the following functions: s MCU I/O Mode
s
s s
CPLD Input - Via the Input Macrocells (IMC). Open Drain/Slew Rate - pins PB3-PB0 can be configured to fast slew rate, pins PB7-PB4 can be configured to Open Drain Mode.
CPLD Output - Macrocells McellAB7-McellAB0 can be connected to Port B. McellBC7McellBC0 can be connected to Port B or Port C.
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Figure 21. Port C Structure
DATA OUT REG. D WR PORT C PIN OUTPUT MUX Q DATA OUT
JTAG ISP
MCELLBC [ 7:0 ] READ MUX
INTERNAL DATA BUS
P D B DATA IN
OUTPUT SELECT
ENABLE OUT
DIR REG. D WR ENABLE PRODUCT TERM (.OE) INPUT MACROCELL Q
CPLD - INPUT
JTAG ISP
CONFIGURATION BIT
AI04907
Port C - Functionality and Structure Port C can be configured to perform one or more of the following functions (see Figure 21): s MCU I/O Mode
s
s
CPLD Output - McellBC7-McellBC0 outputs can be connected to Port B or Port C. CPLD Input - via the Input Macrocells (IMC)
s
In-System Programming (ISP) - JTAG port can be enabled for programming/erase of the device. (See the section entitled "Programming In-Circuit Using JTAG ISP", and Application Note AN1153, for more information on JTAG programming.) Open Drain - Port C pins can be configured in Open Drain Mode
s
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Figure 22. Port D Structure
DATA OUT REG. DATA OUT D WR PORT D PIN OUTPUT MUX ECS[ 2:0] READ MUX Q
INTERNAL DATA BUS
P D B DATA IN
OUTPUT SELECT
DIR REG. D WR Q CPLD-INPUT
ENABLE PRODUCT TERM (.OE)
AI02889
Port D - Functionality and Structure Port D has three I/O pins. See Figure 22 and Figure 23. Port D can be configured to perform one or more of the following functions: s MCU I/O Mode
s
s
PSD Chip Select Input (CSI, PD2). Driving this signal logic High disables the Flash memory, putting it in standby mode.
DPLD Output - External Chip Selects, ECS0-2 does not consume OMCs CPLD Input - direct input to the CPLD, does not use IMCs Slew rate - pins can be set up for fast slew rate Port D pins can be configured in PSDsoft as input pins for other dedicated functions: CLKIN (PD1) as input to the OMCs Flip-flops
s
s
s
External Chip Select. The DPLD also provides three External Chip Select outputs (ESC0-2) on Port D pins that can be used to select external devices as defined in PSDsoft Express. Each External Chip Select consists of one product term that can be configured active High or Low. The output enable of the pin is controlled by either the output enable product term or the Direction Register. (See Figure 23.) External Chip Selects for Port D pins do not consume OMCs. External chip select outputs can also come from the CPLD if chip select equations are specified in PSDsoft Express for Ports B or C.
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Figure 23. Port D External Chip Select Signals
ENABLE (.OE)
DIRECTION REGISTER
PT0
ECS0 POLARITY BIT ENABLE (.OE) DIRECTION REGISTER
PD0 PIN
CPLD AND ARRAY
PLD INPUT BUS
PT1
ECS1 POLARITY BIT ENABLE (.OE) DIRECTION REGISTER
PD1 PIN
PT2
ECS2
PD2 PIN
POLARITY BIT
AI02890
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POWER MANAGEMENT The device offers configurable power saving options. These options may be used individually or in combinations, as follows: s All memory blocks in the device are built with zero-power management technology. Zeropower technology puts the memories into standby mode when address/data inputs are not changing (zero DC current). As soon as a transition occurs on an input, the affected memory "wakes up", changes and latches its outputs, then goes back to standby. The designer does not have to do anything special to achieve memory standby mode when no inputs are changing--it happens automatically. Both PLDs (DPLD and CPLD) are also Zeropower, but this is not the default operation. The DSP must set a bit at run-time to achieve Zeropower as described next. The PMMR registers can be written by the DSP at run-time to manage power. The device has a Turbo bit in the PMMR0 register. This bit can be set to turn the Turbo mode off (the default is with Turbo mode turned on). While Turbo mode is off, the PLDs can achieve standby current when no PLD inputs are changing (zero DC current). Even when inputs do change, significant power can be saved at lower frequencies (AC current),
compared to when Turbo mode is on. When the Turbo mode is on, there is a significant DC current component and the AC component is higher. Further significant power savings can be achieved by blocking signals that are not used in DPLD or CPLD logic equations. The "blocking bits" in PMMR registers can be set to logic 1 by the DSP to block designated signals from reaching both PLDs. Current consumption of the PLDs is directly related to the composite frequency of the changes on their inputs (see Figure 25), so blocking unused PLD inputs can significantly lower PLD operating frequency and power consumption. The DSP also has the option of blocking certain PLD input when not needed, then letting them pass for when needed for specific logic operations. Table 17 and Table 18 define the PMMR registers. PSD Chip Select Input (CSI, PD2) can be used to disable the internal memories and csiop registers, placing them in standby mode even if inputs are changing. This feature does not block any internal signals or disable the PLDs. There is a slight penalty in memory access time when PSD Chip Select Input (CSI, PD2) makes its initial transition from deselected to selected.
s
s
Table 17. Power Management Mode Registers PMMR01
Bit 0 Bit 1 Bit 2 Bit 3 X X X PLD Turbo 1 = off PLD Turbo mode is off, saving power. 0 = on Bit 4 PLD Array clk CLKIN (PD1) input to the PLD AND Array is passed onto PLDs. Every change of CLKIN (PD1) Powers-up the PLD when Turbo bit is 0. 0 0 0 Not used, and should be set to zero. Not used, and should be set to zero. Not used, and should be set to zero.
0 = on PLD Turbo mode is on
1 = off CLKIN (PD1) input to PLD AND Array is blocked, saving power. 0 = on CLKIN (PD1) input to the PLD Macrocells is passed onto PLDs. Bit 5 Bit 6 Bit 7 PLD MCell clk 1 = off CLKIN (PD1) input to PLD Macrocells is blocked, saving power. X X 0 0 Not used, and should be set to zero. Not used, and should be set to zero.
Note: 1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (Reset) pulses do not clear the registers.
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PLD Power Management The power and speed of the PLDs are controlled by the Turbo bit (bit 3) in the PMMR0. By setting the bit to 1, the Turbo mode is off and the PLDs consume the specified stand-by current when the inputs are not switching for an extended time of 70 ns (100 ns for 3.3 V devices). The propagation delay time is increased by 10 ns after the Turbo bit is set to 1 (turned off) when the inputs change at a composite frequency of less than 15 MHz (10 MHz for 3.3 V devices). When the Turbo bit is reset to 0 (turned on), the PLDs run at full power and speed. The Turbo bit affects the PLD's DC power, AC power, and propagation delay. Blocking MCU control signals with the bits of the PMMR registers can further reduce PLD AC power consumption by lowering the effective composite frequency of inputs to the PLDs.
Table 18. Power Management Mode Registers PMMR2 1
Bit 0 Bit 1 Bit 2 X X PLD Array CNTL0 PLD Array CNTL1 PLD Array CNTL2 PLD Array PD0 PLD Array PC7 X 0 0 Not used, and should be set to zero. Not used, and should be set to zero.
0 = on Cntl0 input to the PLD AND Array is passed onto PLDs. 1 = off Cntl0 input to PLD AND Array is blocked, saving power. 0 = on Cntl1 input to the PLD AND Array is passed onto PLDs. 1 = off Cntl1 input to PLD AND Array is blocked, saving power. 0 = on Cntl2 input to the PLD AND Array is passed onto PLDs. 1 = off Cntl2 input to PLD AND Array is blocked, saving power. 0 = on PD0 input to the PLD AND Array is passed onto PLDs. 1 = off PD0 input to PLD AND Array is blocked, saving power. 0 = on PC7 input to the PLD AND Array is passed onto PLDs. 1 = off PC7 input to PLD AND Array is blocked, saving power. 0 Not used, and should be set to zero.
Bit 3
Bit 4
Bit 5
Bit 6 Bit 7
Note: 1. The bits of this register are cleared to zero following Power-up. Subsequent Reset (Reset) pulses do not clear the registers.
PSD Chip Select Input (CSI, PD2) PD2 of Port D can be configured in PSDsoft Express as PSD Chip Select Input (CSI). When Low, the signal selects and enables the internal Flash memory and I/O blocks for Read or Write operations involving the device. A High on PSD Chip Select Input (CSI, PD2) disables the Flash memory and reduces the device power consumption. However, the PLD and I/O signals remain operational when PSD Chip Select Input (CSI, PD2) is High. There may be a timing penalty when using PSD Chip Select Input (CSI, PD2) depending on the speed grade of the device that you are using. See the timing parameter tSLQV in Table 31. Input Clock. The device provides the option to block CLKIN (PD1) from reaching the PLDs to save AC power consumption. CLKIN (PD1) is an input to the PLD AND Array and the OMCs. If CLKIN (PD1) is not being used as part of the PLD logic equation, the clock should be blocked to save AC power. CLKIN (PD1) is disconnected
from the PLD AND Array or the Macrocells block by setting bits 4 or 5 to a 1 in PMMR0. Input Control Signals. The device provides the option to block the input control signals (CNTL0, CNTL1, CNTL2, PD0, and PC7) from reaching the PLDs to save AC power consumption. These control signals are inputs to the PLD AND Array. If any of these are not being used as part of the PLD logic equation, these control signals should be disabled to save AC power. They are disconnected from the PLD AND Array by setting bits 2, 3, 4, 5, and 6 to a 1 in the PMMR2 register. Note: CNTL0 and CNTL1 (DSP WR and DSP RD) are permanently routed to the Flash memory array and cannot be blocked from the array by the PMMR registers (that's why WR and RD signals do not have to be specified in PSDsoft Express for Flash memory segment chip-select equations for FS0 FS7). CNTL0 and CNTL1 are blocked from the PLDs with PMMR registers bits when these signals are specifically used in logic equations specified in PSDsoft Express.
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Figure 24. Reset (RESET) Timing
VCC
VCC(min) tNLNH tNLNH-A Warm Reset
tNLNH-PO Power-On Reset
tOPR
tOPR
RESET
AI02866b
Power On Reset, Warm Reset, Power-down Power On Reset. Upon Power-up, the device requires a Reset (RESET) pulse of duration tNLNH-PO after VCC is steady. During this time period, the device loads internal configurations, clears some of the registers and sets the Flash memory into Operating mode. After the rising edge of Reset (RESET), the device remains in the Reset mode for an additional period, t OPR, before the first memory access is allowed.
The Flash memory is reset to the Read Array mode upon Power-up. Sector Select FS0-FS7 must all be Low, Write Strobe (WR, CNTL0) High, during Power On Reset for maximum security of the data contents and to remove the possibility of a byte being written on the first edge of Write Strobe (WR, CNTL0). Any Flash memory Write cycle initiation is prevented automatically when V CC is below VLKO.
Table 19. Status During Power-On Reset, Warm Reset and Power-down Mode
Port Configuration MCU I/O PLD Output Power-On Reset Input mode Valid after internal PSD configuration bits are loaded Warm Reset Input mode Valid Power-down Mode Unchanged Depends on inputs to PLD (addresses are blocked in PD mode)
Register PMMR0 and PMMR2 OMC Flip-flop status All other registers
Power-On Reset Cleared to 0 Cleared to 0 by internal Power-On Reset Cleared to 0
Warm Reset Unchanged Depends on .re and .pr equations Cleared to 0
Power-down Mode Unchanged Depends on .re and .pr equations Unchanged
Warm Reset. Once the device is up and running, the device can be reset with a pulse of a much shorter duration, tNLNH. The same tOPR period is needed before the device is operational after warm reset. Figure 24 shows the timing of the Power-up and warm reset. I/O Pin, Register and PLD Status at Reset. Table 19 shows the I/O pin, register and PLD status during Power On Reset, warm reset and Power-
down mode. PLD outputs are always valid during warm reset, and they are valid in Power On Reset once the internal device Configuration bits are loaded. This loading of the device is completed typically long before the V CC ramps up to operating level. Once the PLD is active, the state of the outputs are determined by the PSDsoft Express equations.
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PROGRAMMING IN-CIRCUIT USING JTAG ISP In-System Programming (ISP) can be performed through the JTAG signals on Port C. This serial interface allows programming of the entire DSM device or subsections (i.e. only Flash memory but not the PLDs) without and participation of the DSP. A blank DSM device soldered to a circuit board can be completely programmed in 10 to 25 seconds. The basic JTAG signals; TMS, TCK, TDI, and TDO form the IEEE-1149.1 interface. The DSM device does not implement the IEEE-1149.1 Boundary Scan functions. The DSM uses the JTAG interface for ISP only. However, the DSM device can reside in a standard JTAG chain with other JTAG devices as it will remain in BYPASS mode while other devices perform Boundary Scan. ISP programming time can be reduced as much as 30% by using two more signals on Port C, TSTAT and TERR in addition to TMS, TCK, TDI and TDO. See Table 20. The FlashLINKTM JTAG programming cable available from STMicroelectronics for $59USD and PSDsoft Express software that is available at no charge from www.st.com/psm is all that is needed to program a DSM device using the parallel port on any PC or laptop. By default, the four pins on Port C are enabled for the basic JTAG signals TMS, TCK, TDI, and TDO on a blank device (and as shipped from factory) See Application Note AN1153 for more details on JTAG In-System Programming (ISP). Standard JTAG Signals. The standard JTAG signals (TMS, TCK, TDI, and TDO) can be enabled by any of three different conditions that are logically ORed. The following symbolic logic equation specifies the conditions enabling the four basic JTAG signals (TMS, TCK, TDI, and TDO) on their respective Port C pins. For purposes of discussion, the logic label JTAG_ON is used. When JTAG_ON is true, the four pins are enabled for JTAG operation. When JTAG_ON is false, the four pins can be used for general device I/O as specified in PSDsoft Express. JTAG_ON can become true by any of three different ways as shown: JTAG_ON = 1. PSDsoft Express Pin Configuration -OR2. PSDsoft Express PLD equation -OR3. DSP writes to register in csiop block Method 1 is most common. This is when the JTAG pins are selected in PSDsoft Express to be "dedicated" JTAG pins. They can always transmit and receive JTAG information because they are "fulltime" JTAG pins.
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Method 2 is used only when the JTAG pins are multiplexed with general I/O functions. For designs that need every I/O pin, the JTAG pins may be used for general I/O when they are not used for ISP. However, when JTAG pins are multiplexed with general I/O functions, the designer must include a way to get the pins back into JTAG mode when it is time for JTAG operations again. In this case, a single PLD input from Ports B, C, or D must be dedicated to switch the Port C pins from I/ O mode back to ISP mode at any time. It is recommended to physically connect this dedicated PLD input pin to the JEN\ output signal from the Flashlink cable when multiplexing JTAG signals. See Application Note AN1153 for details. Method 3 is rarely used to control JTAG pin operation. The DSP can set the port C pins to function as JTAG ISP by setting the JTAG Enable bit in a register of the csiop block, but as soon as the DSM chip is reset, the csiop block registers are cleared, which turns off the JTAG-ISP function. Controlling JTAG pins using this method is not recommended. Table 20. JTAG Port Signals
Port C Pin PC0 PC1 PC3 PC4 PC5 PC6 JTAG Signals TMS TCK TSTAT TERR TDI TDO Description Mode Select Clock Status Error Flag Serial Data In Serial Data Out
JTAG Extensions. TSTAT and TERR are two JTAG extension signals (must be used as a pair) enabled by a command received over the four standard JTAG signals (TMS, TCK, TDI, and TDO) by PSDsoft Express. They are used to speed Program and Erase cycles by indicating status on device pins instead of having to scan the status out serially using the standard JTAG channel. See Application Note AN1153. TERR indicates if an error has occurred when erasing a sector or programming a byte in Flash memory. This signal goes Low (active) when an Error condition occurs. TSTAT behaves the same as Ready/Busy described previously. TSTAT is inactive logic 1 when the device is in Read mode (Flash memory contents can be read). TSTAT is logic 0 when Flash memory Program or Erase cycles are in progress. TSTAT and TERR can be configured as opendrain type signals with PSDsoft Express. This facilitates a wired-OR connection of TSTAT signals
DSM2190F4
from multiple DSM2190F4V devices and a wiredOR connection of TERR signals from those same devices. This is useful when several devices are "chained" together in a JTAG environment. PSDsoft Express puts TSTAT and TERR signals to open-drain by default. Click on 'Properties' in the JTAG-ISP window of PSDsoft Express to change to standard CMOS push-pull. It is recommended to use 10 k pull-up resistors to VCC on all JTAGISP signals on your circuit board. Initial Delivery State When delivered from ST, the device has all bits in the memory and PLDs erased to logic 1. The DSM Configuration Register bits are set to 0. The code, configuration, and PLD logic are loaded using the programming procedure. The four basic JTAG ISP signals (TCK, TMS, TDI, TDO) are ready for ISP function.
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AC/DC PARAMETERS These tables describe the AC and DC parameters of the device: t DC Electrical Specification t AC Timing Specification s PLD Timing - Combinatorial Timing - Synchronous Clock Mode - Asynchronous Clock Mode - Input Macrocell Timing
s s
s
In the DC specification the supply current is given for different modes of operation. Before calculating the total power consumption, determine the percentage of time that the device is in each mode. Also, the supply power is considerably different if the Turbo bit is 0. The AC power component gives the PLD and Flash memory a mA/MHz specification. Figure 25 shows the PLD mA/MHz as a function of the number of Product Terms (PT) used. The fitter report of PSDsoft Express indicates the number of Product Terms (PTs) used for a given design. This number may be used to estimate PLD power consumption using Figure 25. In the PLD timing parameters, add the required delay when Turbo bit is 0.
DSP Timing - Read Timing - Write Timing - Reset Timing
s
The following are issues concerning the parameters presented:
s
Figure 25. PLD ICC /Frequency Consumption (3.3 V)
60 VCC = 3V 50 ICC - (mA) 40
B TUR N( OO 100% )
FF
30
O
TU
20 10
O TURB
RB
ON (2
5%)
O
TU
0 0
RB
5
O
OF
F
PT 100% PT 25%
10
15
20
25
AI03100
HIGHEST COMPOSITE FREQUENCY AT PLD INPUTS (MHz)
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MAXIMUM RATING Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not imTable 21. Absolute Maximum Ratings
Symbol TSTG TLEAD VIO VCC VPP VESD Storage Temperature Lead Temperature during Soldering (20 seconds max.)1 Input and Output Voltage (Q = VOH or Hi-Z) Supply Voltage Device Programmer Supply Voltage Electrostatic Discharge Voltage (Human Body model) 2 -0.6 -0.6 -0.6 -2000 Parameter Min. -65 Max. 125 235 7.0 7.0 14.0 2000 Unit C C V V V V
plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents.
Note: 1. IPC/JEDEC J-STD-020A 2. JEDEC Std JESD22-A114A (C1=100 pF, R1=1500 , R2=500 )
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DC AND AC PARAMETERS This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the MeasureTable 22. Operating Conditions
Symbol VCC TA Supply Voltage Ambient Operating Temperature (industrial) Parameter Min. 3.0 -40 Max. 3.6 85 Unit V C
ment Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters.
Table 23. AC Measurement Conditions
Symbol CL Load Capacitance Input Rise and Fall Times Input Pulse Voltages Input and Output Timing Reference Voltages
Note: 1. Output Hi-Z is defined as the point where data out is no longer driven.
Parameter
Min. 30
Max.
Unit pF
5 1.5 1.5
ns V V
Figure 26. AC Measurement I/O Waveform
Figure 27. AC Measurement Load Circuit
2.0 V 0.9VCC Test Point 0V
AI04947
1.5V Device Under Test
400
CL = 30 pF (Including Scope and Jig Capacitance)
AI04948
Table 24. Capacitance
Symbol CIN COUT CVPP Parameter Input Capacitance (for input pins) Output Capacitance (for input/ output pins) Capacitance (for CNTL2/VPP) Test Condition VIN = 0V VOUT = 0V VPP = 0V Typ.2 4 8 18 Max. 6 12 25 Unit pF pF pF
Note: 1. Sampled only, not 100% tested. 2. Typical values are for T A = 25C and nominal supply voltages.
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Table 25. AC Symbols for PLD Timing
Signal Letters A C D E N P Q R S W B M Address Input CEout Output Input Data E Input Reset Input or Output Port Signal Output Output Data RD Input (read) Chip Select Input, BMS, DMS, IOMS, or FSx WR Input (write) VSTBY Output Output Macrocell t L H V X Z PW Time Logic Level Low Logic Level High Valid No Longer a Valid Logic Level Float Pulse Width Signal Behavior
Example: tAVWL - Time from Address Valid to Write input Low. Figure 28. Switching Waveforms - Key
WAVEFORMS INPUTS OUTPUTS
STEADY INPUT
STEADY OUTPUT
MAY CHANGE FROM HI TO LO MAY CHANGE FROM LO TO HI
WILL BE CHANGING FROM HI TO LO WILL BE CHANGING LO TO HI
DON'T CARE
CHANGING, STATE UNKNOWN
OUTPUTS ONLY
CENTER LINE IS TRI-STATE
AI03102
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Table 26. DC Characteristics
Symbol VIH VIL VIH1 VIL1 VHYS VLKO Parameter High Level Input Voltage Low Level Input Voltage Conditions 3.0 V < VCC < 3.6 V 3.0 V < VCC < 3.6 V Min. 0.7VCC -0.5 0.8VCC -0.5 0.3 1.5 IOL = 20 A, VCC = 3.0V Output Low Voltage IOL = 4 mA, VCC = 3.0 V Output High Voltage Except VSTBY On Output High Voltage VSTBY On Idle Current (VSTBY input) SRAM Data Retention Voltage Stand-by Supply Current for Power-down Mode Input Leakage Current Output Leakage Current IOH = -20 A, VCC = 3.0 V IOH = -2 mA, VCC = 3.0 V IOH1 = 1 A VCC > VSTBY Only on VSTBY CSI >VCC -0.3 V (Notes 2,3) VSS < VIN < VCC 0.45 < VIN < VCC PLD_TURBO = Off, f = 0 MHz (Note 3) PLD_TURBO = On, f = 0 MHz During Flash memory Write/ Flash memory Erase Only Read Only, f = 0 MHz -1 -10 2.9 2.7 VSTBY - 0.8 -0.1 2 25 .1 5 0 200 10 0 400 25 0 100 1 10 0.1 0.15 2.99 2.6 0.45 V V V V A V A A A A/PT A/PT mA mA 0.01 2.2 0.1 Typ. Max. VCC +0.5 0.8 VCC +0.5 0.2VCC -0.1 Unit V V V V V V V
Reset High Level Input Voltage (Note 1) Reset Low Level Input Voltage Reset Pin Hysteresis VCC (min) for Flash Erase and Program (Note 1)
VOL
VOH VOH1 IIDLE VDF ISB ILI ILO
PLD Only ICC (DC) (Note 5) Operating Supply Current
PLD AC Adder ICC (AC) (Note 5) Flash memory AC Adder
(see note 4) 1.5 2.0 mA/ MHz
Note: 1. 2. 3. 4. 5.
Reset (Reset) has hysteresis. VIL1 is valid at or below 0.2VCC -0.1. VIH1 is valid at or above 0.8VCC . CSI deselected. PLD is in non-Turbo mode, and none of the inputs are switching. Please see Figure 25 for the PLD current calculation. IOUT = 0 mA
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Table 27. CPLD Combinatorial Timing
-15 Symbol Parameter CPLD Input Pin/Feedback to CPLD Combinatorial Output CPLD Input to CPLD Output Enable CPLD Input to CPLD Output Disable CPLD Register Clear or Preset Delay CPLD Register Clear or Preset Pulse Width CPLD Array Delay Any Macrocell 30 29 Add 4 Conditions Min tPD tEA tER tARP tARPW tARD Max 45 45 45 43 PT Aloc Add 4 Turbo Off Add 20 Add 20 Add 20 Add 20 Add 20 Slew Rate1 Sub 6 Sub 6 Sub 6 Sub 6 Unit
ns ns ns ns ns ns
Note: 1. Fast Slew Rate output available on PB3-PB0, and PD2-PD0.
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Table 28. CPLD Macrocell Synchronous Clock Mode Timing
-15 Symbol Parameter Maximum Frequency External Feedback fMAX Maximum Frequency Internal Feedback (fCNT) Maximum Frequency Pipelined Data tS tH tCH tCL tCO tARD tMIN Input Setup Time Input Hold Time Clock High Time Clock Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period2 Clock Input Clock Input Clock Input Any Macrocell tCH+tCL 29 Conditions Min 1/(tS+tCO) 1/(tS+tCO-10) 1/(tCH+tCL) 25 0 15 15 28 29 Add 4 Sub 6 Max 18.8 23.2 33.3 Add 4 Add 20 PT Aloc Turbo Off Slew Rate1 Unit
MHz MHz MHz ns ns ns ns ns ns ns
Note: 1. Fast Slew Rate output available on PB3-PB0, and PD2-PD0. 2. CLKIN (PD1) t CLCL = tCH + tCL .
Table 29. CPLD Macrocell Asynchronous Clock Mode Timing
-15 Symbol Parameter Maximum Frequency External Feedback fMAXA Maximum Frequency Internal Feedback (fCNTA) Maximum Frequency Pipelined Data tSA tHA tCHA tCLA tCOA tARD tMINA Input Setup Time Input Hold Time Clock High Time Clock Low Time Clock to Output Delay CPLD Array Delay Minimum Clock Period Any Macrocell 1/fCNTA 42 Conditions Min 1/(tSA+tCOA) 1/(tSA+tCOA-10) 1/(tCHA+tCLA) 12 15 22 15 40 29 Add 4 Add 20 Add 20 Add 20 Sub 6 Max 19.2 23.8 27 Add 4 Add 20 PT Aloc Turbo Off Slew Rate Unit
MHz MHz MHz ns ns ns ns ns ns ns
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Figure 29. Input to Output Disable / Enable
INPUT
tER INPUT TO OUTPUT ENABLE/DISABLE
tEA
AI02863
Figure 30. Asynchronous Reset / Preset
tARPW
RESET/PRESET INPUT tARP REGISTER OUTPUT
AI02864
Figure 31. Synchronous Clock Mode Timing - PLD
tCH tCL
CLKIN
tS INPUT
tH
tCO REGISTERED OUTPUT
Figure 32. Asynchronous Clock Mode Timing (product term clock)
tCHA tCLA
CLOCK
tSA
tHA
INPUT tCOA REGISTERED OUTPUT
AI02859
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Table 30. Input Macrocell Timing
-15 Symbol tIS tIH tINH tINL tINO Parameter Input Setup Time Input Hold Time NIB Input High Time NIB Input Low Time NIB Input to Combinatorial Delay Conditions Min (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) 0 25 13 13 62 Add 4 Add 20 Add 20 Max PT Aloc Turbo Off Unit ns ns ns ns ns
Note: 1. Inputs from Port B, and C relative to register/latch clock from the PLD.
Figure 33. Input Macrocell Timing (product term clock)
t INH
PT CLOCK
t INL
t IS
INPUT
t IH
OUTPUT
t INO
AI03101
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Table 31. Read Timing
-15 Symbol tAVQV tSLQV tRLQV tRHQX tRLRH tRHQZ Parameter Address Valid to Data Valid CS Valid to Data Valid RD to Data Valid 8-Bit Bus RD Data Hold Time RD Pulse Width RD to Data High-Z 1 40 20 Conditions Min (Note 1) Max 150 150 35 Turbo Off Add 20 Unit ns ns ns ns ns ns
Note: 1. Any input used to select an internal DSM function.
Figure 34. Read Timing
tAVQV ADDRESS NON-MULTIPLEXED BUS DATA NON-MULTIPLEXED BUS tSLQV CSI tRLQV tRLRH RD tRHQZ tRHQX ADDRESS VALID
DATA VALID
AI04908
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Table 32. Write Timing
-15 Symbol tAVWL tSLWL tDVWH tWHDX tWLWH tWHAX1 tWHAX2 tWHPV tDVMV tWLMV
Note: 1. 2. 3. 4.
Parameter Address Valid to Leading Edge of WR CS Valid to Leading Edge of WR WR Data Setup Time WR Data Hold Time WR Pulse Width Trailing Edge of WR to Address Invalid Trailing Edge of WR to DPLD Address Invalid Trailing Edge of WR to Port Output Valid Using I/O Port Data Register Data Valid to Port Output Valid Using Macrocell Register Preset/Clear WR Valid to Port Output Valid Using Macrocell Register Preset/Clear
Conditions Min (Notes 1) 0 0 45 2 48 1.75 (Note4) 0 35 (Note 3) (Note 2) 70 70 Max
Unit ns ns ns ns ns ns ns ns ns ns
Any input used to select an internal PSM function. Assuming data is stable before active write signal. Assuming write is active before data becomes valid. TWHAX2 is the address hold time for DPLD inputs that are used to generate Sector Select signals for internal DSM memory.
Figure 35. Write Timing
tAVWL ADDRESS NON-MULTIPLEXED BUS DATA NON-MULTIPLEXED BUS tSLWL CSI tDVWH WR t WLWH t WHDX t WHAX ADDRESS VALID DATA VALID
AI04909
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Table 33. Flash Memory Program, Write and Erase Times
Symbol Parameter Flash Bulk Erase1 (pre-programmed) Flash Bulk Erase (not pre-programmed) tWHQV3 tWHQV2 tWHQV1 Sector Erase (pre-programmed) Sector Erase (not pre-programmed) Byte Program Program / Erase Cycles (per Sector) tWHWLO tQ7VQV Sector Erase Time-Out DQ7 Valid to Output (DQ7-DQ0) Valid (Data Polling)2 100,000 100 30 Min. Typ. 3 5 1 2.2 14 1200 30 Max. 30 Unit s s s s s cycles s ns
Note: 1. Programmed to all zero before erase. 2. The polling status, DQ7, is valid tQ7VQV time units before the data byte, DQ0-DQ7, is valid for reading.
Table 34. Reset (Reset) Timing
Symbol tNLNH tNLNH-PO tOPR Parameter RESET Active Low Time 1 Power On Reset Active Low Time RESET High to Operational Device Conditions Min 300 1 300 Max Unit ns ms ns
Note: 1. Reset (RESET) does not reset Flash memory Program or Erase cycles. 2. Warm reset aborts Flash memory Program or Erase cycles, and puts the device in Read mode.
Figure 36. Reset (RESET) Timing
VCC
VCC(min) tNLNH tNLNH-A Warm Reset
tNLNH-PO Power-On Reset
tOPR
tOPR
RESET
AI02866b
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Table 35. ISC Timing
-15 Symbol tISCCF tISCCH tISCCL tISCCFP tISCCHP tISCCLP tISCPSU tISCPH tISCPCO tISCPZV tISCPVZ Parameter Clock (TCK, PC1) Frequency (except for PLD) Clock (TCK, PC1) High Time (except for PLD) Clock (TCK, PC1) Low Time (except for PLD) Clock (TCK, PC1) Frequency (PLD only) Clock (TCK, PC1) High Time (PLD only) Clock (TCK, PC1) Low Time (PLD only) ISC Port Set Up Time ISC Port Hold Up Time ISC Port Clock to Output ISC Port High-Impedance to Valid Output ISC Port Valid Output to High-Impedance Conditions Min (Note 1) (Note 1) (Note 1) (Note 2) (Note 2) (Note 2) 240 240 13 5 36 36 36 45 45 2 Max 10 MHz ns ns MHz ns ns ns ns ns ns ns Unit
Note: 1. For non-PLD Programming, Erase or in ISC by-pass mode. 2. For Program or Erase PLD only.
Figure 37. ISC Timing
t ISCCH
TCK
t ISCCL t ISCPSU t ISCPH
TDI/TMS
t ISCPZV t ISCPCO
ISC OUTPUTS/TDO
t ISCPVZ
ISC OUTPUTS/TDO
AI02865
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PACKAGE MECHANICAL PLCC52 - 52 lead Plastic Leaded Chip Carrier, rectangular, Package Outline
D D1 M
1N
A1 A2 M1
b1
E1 E
D2/E2 D3/E3 b L1 L C A CP
e
PLCC-B
Note: Drawing is not to scale.
PLCC52 - 52 lead Plastic Leaded Chip Carrier, rectangular, Package Mechanical Data
Symbol A A1 A2 B B1 C D D1 D2 E E1 E2 e R N Nd Ne 1.27 0.89 mm Typ. Min. 4.19 2.54 - 0.33 0.66 0.246 19.94 19.05 17.53 19.94 19.05 17.53 - - 52 13 13 Max. 4.57 2.79 0.91 0.53 0.81 0.261 20.19 19.15 18.54 20.19 19.15 18.54 - - 0.050 0.035 Typ. inches Min. 0.165 0.100 - 0.013 0.026 0.0097 0.785 0.750 0.690 0.785 0.750 0.690 - - 52 13 13 Max. 0.180 0.110 0.036 0.021 0.032 0.0103 0.795 0.754 0.730 0.795 0.754 0.730 - -
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Table 36. Assignments - PLCC52
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Pin Assignments GND PB5 PB4 PB3 PB2 PB1 PB0 PD2 PD1 PD0 PC7 PC6 PC5 PC4 VCC GND PC3 PC2 (VSTBY) PC1 PC0 PA7 PA6 PA5 PA4 PA3 GND Pin No. 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 Pin Assignments PA2 PA1 PA0 AD0 AD1 AD2 AD3 AD4 AD5 AD6 AD7 VCC AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 CNTL0 RESET CNTL2 CNTL1 PB7 PB6
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PQFP52 - 52 lead Plastic Quad Flatpack, Package Outline
D D1 D2 A2
e Ne E2 E1 E b
N 1
Nd L1
A CP
c
QFP
A1
L
Note: Drawing is not to scale.
PQFP52 - 52 lead Plastic Quad Flatpack, Package Mechanical Data
Symb. A A1 A2 b c D D1 D2 E E1 E2 e L L1 N Nd Ne CP 13.20 10.00 7.80 13.20 10.00 7.80 0.65 0.88 1.60 2.00 1.80 0.22 0.11 12.95 9.90 - 12.95 9.90 - - 0.73 - 0 52 13 13 0.10 mm Typ. Min. Max. 2.35 0.25 2.10 0.38 0.23 13.45 10.10 - 13.45 10.10 - - 1.03 - 7 0.520 0.394 0.307 0.520 0.394 0.307 0.026 0.035 0.063 0 52 13 13 0.004 7 0.029 0.041 0.079 0.077 0.009 0.004 0.510 0.390 - 0.510 0.390 - Typ. inches Min. Max. 0.093 0.010 0.083 0.015 0.009 0.530 0.398 - 0.530 0.398 -
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Table 37. Pin Assignments - PQFP52
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Pin Assignments PD2 PD1 PD0 PC7 PC6 PC5 PC4 VCC GND PC3 PC2 PC1 PC0 PA7 PA6 PA5 PA4 PA3 GND PA2 PA1 PA0 AD0 AD1 AD2 AD3 Pin No. 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 Pin Assignments AD4 AD5 AD6 AD7 VCC AD8 AD9 AD10 AD11 AD12 AD13 AD14 AD15 CNTL0 RESET CNTL2 CNTL1 PB7 PB6 GND PB5 PB4 PB3 PB2 PB1 PB0
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PART NUMBERING Table 38. Ordering Information Scheme
Example: DSM21 90 F4 V - 15 T 6
Device Type DSM21 = DSP System Memory for ADSP-21XX Family DSP Applicability 90 = Analog Devices ADSP-219X family
Memory Density F4 = 2Mbit x 8 (256K Bytes)
Operating Voltage (Vcc) V = 3.3V 10% Access Time 15 = 150 ns Package K = 52-pin PLCC T = 52-pin PQFP Temperature Range 6 = -40 to 85oC (Industrial)
For a list of available options (speed, package, etc.) or for further information on any aspect of this
device, please contact your nearest ST Sales Office.
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REVISION HISTORY Table 39. Document Revision History
Date 27-Aug-2001 06-Nov-2001 17-Dec-2001 18-Sep-2002 Rev. 1.0 1.1 1.2 1.3 Document written Document released PQFP52 package mechanical data updated JTAG Debug bus separated from JTAG ISP bus Description of Revision
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is registered trademark of STMicroelectronics All other names are the property of their respective owners (c) 2002 STMicroelectronics - All Rights Reserved STMicroelectronics group of companies Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States. www.st.com
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